Modification of Epoxy Resin with Silicone for Electronic Encapsulation Application

Abstract

The reaction was carried out with a solventless (hot-melt) method using epoxy resin (E-20) as a base material and dihydroxydiphenylsilane (DHDPS) or polymethyltriethoxysilane (PTS) as a modifier. IR spectrum, epoxy value of modified epoxy resins indicated that DHDPS and PTS were incorporated into epoxy resin respectively. The influences of silicone contents on softening point and thermal resistance of cured silicone modified epoxy resin systems were studied. The thermal stability was investigated by thermogravimetic analysis (TGA). Effects of the viscosity of packaging slurry on the performance of encapsulated electronic elements were also investigated. In contrast to ED-20 cured system, the thermal resistance, toughness, humidity resistance of ETS-20 cured systems improved more obvious. And ETS-20 has exhibited excellent resistance to the thermal shock cycling test. It indicated that ETS-20 can be applicated for electronic encapsulation. The viscosity of packaging slurry was most appropriate when it was 170~200 mPas.

Synthesis and properties of silicone‐epoxy polymer with long silicone chain

“…The modification of epoxy resin with silicone can not only reduce the internal stress, but also improve the toughness and heat resistance. [12][13][14][15][16][17][18] The modification methods include physical modification and chemical modification. The physical blending modification is simple and low cost.…”