The kinetics of UV curable thiol-hyperbranched polysilazanes (HBP) was studied by differential photo-scanning calorimeter (DPC) technology. The effects of photo initiator concentration [I], light intensity I0and temperature on the UV curing rate and the final unsaturated double bond conversion of thiol-HBP were investigated. The results indicate that the dependence of polymerization rate Rp on [I] and I0, respectively, was found to fit with theoretical predictions very well at [I] no more than 0.50wt% and I0lower than 19.40mW/cm2. The kinetic parameters were calculated by autocatalytic model, and correspondingly, the total apparent reaction exponent and apparent activation energy are 8.76 and 13.97kJ/mol, respectively.

The reaction was carried out with a solventless (hot-melt) method using epoxy resin (E-20) as a base material and dihydroxydiphenylsilane (DHDPS) or polymethyltriethoxysilane (PTS) as a modifier. IR spectrum, epoxy value of modified epoxy resins indicated that DHDPS and PTS were incorporated into epoxy resin respectively. The influences of silicone contents on softening point and thermal resistance of cured silicone modified epoxy resin systems were studied. The thermal stability was investigated by thermogravimetic analysis (TGA). Effects of the viscosity of packaging slurry on the performance of encapsulated electronic elements were also investigated. In contrast to ED-20 cured system, the thermal resistance, toughness, humidity resistance of ETS-20 cured systems improved more obvious. And ETS-20 has exhibited excellent resistance to the thermal shock cycling test. It indicated that ETS-20 can be applicated for electronic encapsulation. The viscosity of packaging slurry was most appropriate when it was 170~200 mPas.

A novel phenolic resin suitable for hot-melt impregnation process was developed through copolymerization. The curing reactivity, gel properties and viscosity of the resin were tested to evaluate the resin reaction process. A prepreg of this resin and glass fabrics was developed with hot-melt process. The cured phenolic prepreg laminates havebalanced mechanical properties. It can be used to manufacture interior structures for airplanes and high-speed trains or other applications with flame retard requirement.

Bis (p-aminophenoxy) dimethylsilane (p-APDS) was prepared by the reaction ofp-aminophenol or 4-acetamidophenol with dimethyldichlorosilane in the presence of triethylamine or pyridine through four different means. The structure of diamines was examined by melting point apparatus, FT-IR and nuclear magnetic resonance apparatus1H-NMR. The productivity, process and cost of four means were compared. The results showed that benzene as a solvent, triethylamine as acid,p-aminophenol and dimethyl dichlorosilane at 40°C for 4h is the most economical and reasonable process for synthesis of bis (p-aminophenoxy) dimethylsilane (p-APDS).

A novel modified thermosetting phenolic resin was synthesized by bulk polymerization. The main process of the phenolic resin film formation was studied by tensile shear test. The preparation technology was determined by the investigation of viscosity behavior, gel properties and the data of DSC. The flexible rolled resin film was manufactured at 100±3°C while the moving speed of release paper is at 2 m/min on hot melt machine made in California Graphite Machines Inc. USA. The area weight of the film is 400±20 g/m2, the width of that is 300 mm and the thickness of that is 0.32±0.04 mm.