N-(4-hydroxyphenyl)maleimide was melt-blended with the glycidyl ether of bisphenol-A and various mole percentages of 4, 4 -(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (T o ) and peak exothermic (T exo ) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (T g s) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 • C and good thermal stabilities up to 400 • C.