Modular packaging concept for MEMS and MOEMS

Stenchly, Vanessa; Reinert, Wolfgang; Quenzer, Hans-Joachim

doi:10.1088/1742-6596/922/1/012015

Cited by 5 publications

(9 citation statements)

References 4 publications

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“…Now, vacuum MEMS packaging can be performed at wafer level instead of the previous cost-intensive hybrid package. [40][41][42][43]. Two examples of wafer-level MEMS vacuum packages are exemplarily shown in Figure 2.…”

Section: Motivation Of This Studymentioning

confidence: 99%

“…Vertical feedthroughs are also often used for electrical signal transfer from the inner cavity of WLVP. Concerning the wafer-level-packaging of micro scanning mirrors, we mention the state of the art described in [40][41][42][43]. Here, a micro molded glass cap wafer with 400-900 µ m cavity height is anodically bonded to the polished surface of an epi-polysilicon MEMS device [40,41].…”

Section: Motivation Of This Studymentioning

confidence: 99%

“…A broad variety of wafer-level vacuum-packaging technologies and wafer bond techniques exists for hermetic sealing of smart MEMS sensors [ 39 ] or MOEMS devices, e.g., torsional MEMS mirrors [ 40 , 41 , 42 , 43 ]. Two examples of wafer-level MEMS vacuum packages are exemplarily shown in Figure 2 .…”

Section: Introductionmentioning

confidence: 99%

“…In [ 42 ], an inner vacuum pressure of 0.1 Pa was reported using a titanium thin-film getter. Furthermore, a modular packaging concept for MOEMS was presented in [ 43 ] allowing also vacuum packages with integrated vertical electrical feedthroughs (through-glass via, TGA).…”

Section: Introductionmentioning

confidence: 99%

“…Specification of NIR-FTS and boundary conditions for MEMS device. bond techniques exists for hermetic sealing of smart MEMS sensors [39] or MOEMS devices, e.g., torsional MEMS mirrors[40][41][42][43]. Two examples of wafer-level MEMS vacuum packages are exemplarily shown in Figure2.…”

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confidence: 99%

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Wafer-Level Vacuum-Packaged Translatory MEMS Actuator with Large Stroke for NIR-FT Spectrometers

et al. 2020

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We present a wafer-level vacuum-packaged (WLVP) translatory micro-electro-mechanical system (MEMS) actuator developed for a compact near-infrared-Fourier transform spectrometer (NIR-FTS) with 800–2500 nm spectral bandwidth and signal-nose-ratio (SNR) > 1000 in the smaller bandwidth range (1200–2500 nm) for 1 s measuring time. Although monolithic, highly miniaturized MEMS NIR-FTSs exist today, we follow a classical optical FT instrumentation using a resonant MEMS mirror of 5 mm diameter with precise out-of-plane translatory oscillation for optical path-length modulation. Compared to highly miniaturized MEMS NIR-FTS, the present concept features higher optical throughput and resolution, as well as mechanical robustness and insensitivity to vibration and mechanical shock, compared to conventional FTS mirror drives. The large-stroke MEMS design uses a fully symmetrical four-pantograph suspension, avoiding problems with tilting and parasitic modes. Due to significant gas damping, a permanent vacuum of ≤3.21 Pa is required. Therefore, an MEMS design with WLVP optimization for the NIR spectral range with minimized static and dynamic mirror deformation of ≤100 nm was developed. For hermetic sealing, glass-frit bonding at elevated process temperatures of 430–440 °C was used to ensure compatibility with a qualified MEMS processes. Finally, a WLVP MEMS with a vacuum pressure of ≤0.15 Pa and Q ≥ 38,600 was realized, resulting in a stroke of 700 µm at 267 Hz for driving at 4 V in parametric resonance. The long-term stability of the 0.2 Pa interior vacuum was successfully tested using a Ne fine-leakage test and resulted in an estimated lifetime of >10 years. This meets the requirements of a compact NIR-FTS.

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Section: Motivation Of This Studymentioning

confidence: 99%

Section: Motivation Of This Studymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

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Wafer-Level Vacuum-Packaged Translatory MEMS Actuator with Large Stroke for NIR-FT Spectrometers

et al. 2020

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Unique Method of Si Lenses Fabrication for Wafer Level Packaging

Kulkarni

Laske

Malaurie

et al. 2019

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems &Amp; Eurosensors XXXIII (TRANSDUCERS &Am

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Cutting behavior and surface defects in ultra-precision grinding of glassy carbon

Jahnel,

Wilhelm,

Rojacher

et al. 2024

Eleventh European Seminar on Precision Optics Manufacturing

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This study investigates the cutting behavior and surface defects in ultra-precision grinding of glassy carbon, an alternative material for mold manufacturing. The aim was to gain a comprehensive understanding of the cutting behavior to determine the suitability of ultra-precision grinding for mold manufacturing. Therefore, glassy carbon samples were ground flat and the process parameter cutting speed, cutting depth, and diamond grain size of the tool were altered. The machined surface was measured by interferometry and a scanning electron microscope to analyze the surface roughness and topography. The investigations show that ultra-precision grinding is capable of creating nearly defect-free surfaces with resulting surface roughness Sq lower than 5 nm. Additionally, it is analyzed, that the dominant cutting behavior is brittle, and the surface topography created is probably based on the fullerene-like structure from glassy carbon itself. In the case of occurring defects, the dominant breakouts are clods and resulting gaps in the surface topography. Further investigations are required to investigate the subsurface after grinding and its influence on the glass molding process.

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Modular packaging concept for MEMS and MOEMS

Cited by 5 publications

References 4 publications

Wafer-Level Vacuum-Packaged Translatory MEMS Actuator with Large Stroke for NIR-FT Spectrometers

Wafer-Level Vacuum-Packaged Translatory MEMS Actuator with Large Stroke for NIR-FT Spectrometers

Unique Method of Si Lenses Fabrication for Wafer Level Packaging

Cutting behavior and surface defects in ultra-precision grinding of glassy carbon

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