RF MEMS technology shows great promise for wireless communication and other RF applications. However, the packaging of RF MEMS devices becomes one of the most important issues in MEMS device fabrication and presents challenges due to the unique requirements. Special precautions are not only required to allow assembly processes after releasing the delicate structures but also to ensure the structures to operate in a stable atmosphere during its entire lifetime. These requirements come on top of the other wellknown requirements for cell phone components: cost, size and height. NXP Semiconductors has developed an efficient packaging technology for RF-MEMS devices in close cooperation with the Fraunhofer Institute in Itzehoe (ISiT). This paper presents a summary of several major aspects of our development activities in order to generate this new packaging technology.

No abstract

No abstract

Vacuum wafer bonding technology provides a number of very effective techniques to produce low-cost, hermetic sealed packages for micromachined sensors and actuators. Beside the protection of the device from outside environmental stresses, the package must also provide a cavity ambient compatible with the device performance and reliability. The paper reviews the shortcomings of existing fine leak tests to assess the stability of the cavity atmosphere over long time. A new ultra-fine leak test based on Q-factor monitoring was developed that has the potential to be used for in-line critical leak rate testing on wafer level before device singulation. With the example of a poly-silicon resonating microsensor, it is shown that the test is sensitive enough to predict the cavity pressure for a demanded device lifetime of 15 years. The role of an integrated thin film getter in stabilizing the cavity vacuum and extending device lifetime is discussed.

No abstract