Moisture Induced Delamination in Plastic Encapsulated Microelectronic Devices: A Physics of Failure Approach

Abstract

By identifying the moisture concentration at the weakest material interface as the critical parameter for the defect onset, the quantitative prediction of moisture-induced delamination between the molding compound and die surface in plastic packages was realized using a simple 1-D diffusion model. As a result, the delamination onset during multiple soak and reflow procedure, as prescribed by customers' specifications, was predicted from the IPC/JEDEC J-STD-020C moisture sensitivity level. For the case studied here, the soldering peak temperature had the most significant influence on the moisture sensitivity of the package. The remaining part of the soldering temperature profile (ramp up and down) was found to have a rather small influence.

Moisture induced effects in PoP

“…Moisture-induced failures in plastic encapsulated packages are one of the most important failure mechanisms in microelectronics [3,4]. These failures, such as popcorn, delamination and excessive warpage, are driven by the mismatch between the different material properties, such as CTE, hygro-swelling, vapor pressure induced expansion, and degradation of the interfacial strength caused by moisture absorption of the polymer materials.…”

Study on moisture-induced corrosion mechanism of copper wire bonding by thermodynamic calculation

“…Although encapsulation is employed in microelectronic packages to prevent moisture ingress, permeation and leakage are still possible probably because of the difference in the water vapor pressure between the atmosphere inside and outside of the package [5]. In fact, all polymeric materials are permeable to moisture to a lesser or greater extent, and will absorb moisture when installed in a humid environment [6]. The present study is thus focused on the moisture induced corrosion in Cu bond bonding.…”