2013 14th International Conference on Electronic Packaging Technology 2013
DOI: 10.1109/icept.2013.6756580
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Study on moisture-induced corrosion mechanism of copper wire bonding by thermodynamic calculation

Abstract: Understanding the moisture-induced corrosion mechanism of copper wire bonding is crucial for achieving longer life reliability of copper bonding. While the formation of Al-Cu intermetallic compound (IMC) is found to dominate the bond reliability, the mechanism remains unclear despite considerable efforts by experiments. Pourbaix (Eh-pH) diagrams have long been used to evaluate the theoretical activity of a given metal or alloy in a corrosion situation. However, the Eh-pH diagram of Cu-Al alloy in bonding condi… Show more

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