2014
DOI: 10.1016/j.tsf.2013.11.027
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Molecular-beam epitaxial growth of tensile-strained and n-doped Ge/Si(001) films using a GaP decomposition source

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Cited by 26 publications
(20 citation statements)
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“…The sample without the δ-layer presents a rather flat profile with 180 an mean value of about 1.4 × 10 15 cm −3 consistent with the manufacturer specifications of the Ge wafer and the sample with the δ doped layer exhibits the same flat profile except near the interface where the doping concentration increases to about 3 × 10 18 cm −3 . 185 This is in agreement with our previous results and the consideration on the difference between dopant concentrations evaluated by chemical or electrical measurements [27,31].…”
Section: Extraction Of Schottky Diodes Parameterssupporting
confidence: 90%
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“…The sample without the δ-layer presents a rather flat profile with 180 an mean value of about 1.4 × 10 15 cm −3 consistent with the manufacturer specifications of the Ge wafer and the sample with the δ doped layer exhibits the same flat profile except near the interface where the doping concentration increases to about 3 × 10 18 cm −3 . 185 This is in agreement with our previous results and the consideration on the difference between dopant concentrations evaluated by chemical or electrical measurements [27,31].…”
Section: Extraction Of Schottky Diodes Parameterssupporting
confidence: 90%
“…The layer is grown by a co-deposition of Ge evaporated from a two-zone heated Knudsen effusion cell and phosphorous atoms produced by a GaP decomposition source (DECO fom Dr. Eberl MBE-Komponenten GmbH). The growth parameters required to reach the high doping concentration were optimized in a previous work [27]. The Schottky diodes properties were measured with a semiconductor device analyser (Agilent B1500A) in a vacuum chamber at 10 −2 Pa over a temperature range of 30-300 K through a helium-based closed cycle refrigeration system.…”
Section: Experimental Details Devices Fabrication and Characterisationmentioning
confidence: 99%
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“…In the last few years, research on the tensile strained and n-doped Ge thin film on Si substrate has been the subject of many investigations with the hope to realize an Ge active layer in optoelectronic devices totally compatible with CMOS technology [1] [2] [3] [4] [5]. It has been shown that Ge could become direct band gap material when applying a tensile strained value of 1.9% on Ge layer [6].…”
Section: Introductionmentioning
confidence: 99%
“…In the last few years, research on the tensile strained and n-doped Ge thin film on Si substrate has been the subject of many investigations with the hope to realize an Ge active layer in optoelectronic devices totally compatible with CMOS technology [1] [2] [3] [4] [5]. It has been shown that Ge could become direct band gap material when applying a tensile strained value of 1.9% on Ge layer [6].…”
Section: Introductionmentioning
confidence: 99%