Molecular Dynamics Investigation of Residual Stress and Surface Roughness of Cerium under Diamond Cutting

Abstract

Machined surface quality in terms of residual stress and surface roughness has an important influence on the performance of devices and components. In the present work, we elucidate the formation mechanisms of residual stress and surface roughness of single crystalline cerium under ultraprecision diamond cutting by means of molecular dynamics simulations. Influences of machining parameters, such as the rake angle of a cutting tool, depth of cut, and crystal orientation of the workpiece on the machined surface quality were also investigated. Simulation results revealed that dislocation activity and lattice distortion are the two parallel factors that govern the formation of both residual stress and surface roughness. It was found that both distributions of residual stress and surface roughness of machined surface are significantly affected by machining parameters. The optimum machining parameters for achieving high machined surface quality of cerium by diamond cutting are revealed.

Numerical Analysis of Multi-Angle Precision Microcutting of a Single-Crystal Copper Surface Based on Molecular Dynamics

“…It was found that the deeper the depth of grinding, the deeper the surface damage [13]. Li Y and other scholars used molecular dynamics simulation to clarify the formation mechanism of residual stress and surface roughness of an ultra-precision diamond-cut single crystal crucible [14]. Alhafez IA and other scholars systematically studied the single-crystal iron nanocutting process, and found that the edge dislocations formed at the cutting edge slide obliquely to it, resulting in a complex three-dimensional dislocation network [15].…”

Effects of Anisotropy on Single Crystal Silicon in Polishing Non-Continuous Surface

“…For porous crystalline materials, the effect of crystallographic orientations on machining is more complicated. Because of the special geometric structure, the bearing capacity of porous materials will be reduced, and it is difficult to obtain an ideal surface using traditional processing methods [5][6][7][8][9]. Therefore, grasping the structural and property differences caused by the anisotropy of the porous crystalline material during the processing is crucial for selecting the process parameters to obtain an ideal processing surface.…”

“…Cang et al [22] observed obvious elastic anisotropy in glass and found that the elastic anisotropy shows a strong correlation with molecular orientations. Chen et al [23] did some research on cutting SiO2 and found that (100) [00-1] crystallographic orientation has a large range of damage extension, (110) [1][2][3][4][5][6][7][8][9][10] crystallographic orientation has the smallest damage range, and a new phase is generated in the (111) [-101] crystallographic orientation. Nagai et al [24] discussed the formation mechanism of U-shaped diamond grooves based on the experimental results, and successfully obtained a U-shaped diamond trench with vertical {111} sidewalls for power devices.…”

Editorial for the Special Issue on Micro-Machining: Challenges and Opportunities

“…This special issue of Micromachines , entitled “ Micro-Machining: Challenges and Opportunities ”, collects 16 original research papers and one review article that provides updates on the latest micro-machining technologies, including novel research on and development of diamond turning [ 1 , 2 ], micro-milling [ 3 , 4 , 5 ], micro-grinding [ 6 ], polishing [ 7 , 8 , 9 ], laser micro-machining [ 10 , 11 , 12 ], lithography-based micro-machining processes [ 13 ], ultrasonic devices [ 14 ], control systems for hybrid machines [ 15 ], on-machine surface metrology [ 16 ], and the surface and subsurface integrity characterization technique [ 17 ].…”

“…The so-called “size effect” material removal mechanism in micro-machining is different from that of conventional machining. Li et al [ 1 ] applied molecular dynamics simulations to gain an in-depth understanding of formation mechanism of surface roughness and residual stress of single crystal cerium in ultra-precision diamond turning process. Their studies revealed that dislocation and lattice distortion were two factors that govern the formation of surface roughness and residual stress.…”