Molecular dynamics simulation of healing of an ellipsoid crack in copper under compressive stress

Li, M; Chu, W.Y.; Gao, Kewei; Li, Qiao

doi:10.1016/j.matlet.2003.06.016

Cited by 9 publications

(6 citation statements)

References 13 publications

(16 reference statements)

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“…Dislocations may have been formed to accommodate the lattice mismatch between them . Molecular dynamic simulation has revealed that the crack healing process can be promoted by compressive residual stress and accompanied with the generation and propagation of dislocations …”

Section: Resultsmentioning

confidence: 99%

“…35 Molecular dynamic simulation has revealed that the crack healing process can be promoted by compressive residual stress and accompanied with the generation and propagation of dislocations. [36][37][38] Two possible mechanisms, adhesion 39,40 and diffusional bonding, 19,20,41,42 have been suggested to explain the crack healing of alumina ceramics at elevated temperatures. Adhesion is the re-bonding of atoms on the interfaces of the fracture surfaces driven by their deviation from equilibrium.…”

Section: Microstructural Changes After Lsp and Annealingmentioning

confidence: 99%

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Microstructure‐property relation in alumina ceramics during post‐annealing process after laser shock processing

et al. 2018

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Laser shock processing (LSP) is a new surface engineering approach to introduce significant compressive residual stress into ceramics to improve their mechanical properties. However, LSP of ceramics may induce microcracks, which limit the further improvement of mechanical properties of ceramics. In this research, the effect of a post‐LSP annealing process on α‐Al2O3 ceramics was investigated. The annealing treatment can cause thermal relaxation of compressive residual stress generated by LSP while still maintain the positive attribute of LSP. The compressive residual stress was stabilized after annealing after 10 hours at 1100‐1300°C. The healing of microcracks in α‐Al2O3 ceramics was observed during the post‐LSP annealing process, which is caused by diffusion bonding mechanisms and accompanied by dislocation and void formation. The combination of the stabilized compressive residual stress and microcrack healing can improve the cracking resistance of α‐Al2O3 ceramics to mechanical impact on the surface by 69%.

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Section: Resultsmentioning

confidence: 99%

Section: Microstructural Changes After Lsp and Annealingmentioning

confidence: 99%

Microstructure‐property relation in alumina ceramics during post‐annealing process after laser shock processing

et al. 2018

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“…Meanwhile, defects atoms such as dislocation can be shown by noting that the potential energies of individual atoms at values are above the cohesive energy, 26 the method that the defects characterized by the individual atoms energy has been applied successfully to Refs. [26][27][28]. So we also use the energy and stress of individual atoms to denote and characterize the evolvement of defects in workpiece in the nanomachining process.…”

Section: Simulation Modelmentioning

confidence: 99%

Multi-Path Nanometric Cutting of Molecular Dynamics Simulation

Chen¹,

Liang²,

Chen³

et al. 2012

Jnl of Comp & Theo Nano

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Molecular dynamics simulations for multi-path nanomachining process are performed to study the nanomachining mechanism, and to analysis the effect on the surface quality, the subsurface damaged layers, reciprocating cutting force. The results show that the prior cutting process is accompanied with the development of many dislocations. However, in the reciprocating cutting process, atoms are removed mainly by the compressing, extruding and attracting because the defects from the prior cutting process restrict the movement of dislocations. The cutting force from reciprocating cutting process shows more obvious size effect than that from the prior cutting process. Under the same total cutting depth and the different feeding depth, the total cutting force increases as the second feeding depth decreases. While the order degree of the subsurface of the nanostructure increases. The surface quality of the nanomachined surface and the shape of the scratched groove is relation closely to the offset distance of the tool. The affected zone from the second feeding cutting process is larger than that from the prior cutting process. The second feeding cutting force increases as the offset distance of the tool increase. It is noted that the second feeding cutting force is not zero but closed to 30 percent of the prior cutting force under the condition of the offset distance of the tool at 0a 0 . When the offset distance of the tool is 10a 0 , the reciprocating cutting force is up to 90 percent of the prior cutting force.

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“…Larger initial void ellipticity is worth investigating because the shape of the void would approach that of a crack as the void ellipticity approaches 1. While much MD work [14][15][16][17] has explored deformation of metals containing a crack, it remains unexplored to our best knowledge how a voided material grades into a cracked material as the initial void ellipticity increases. To address this, we conduct large scale MD simulations to quantify the effects of initial void ellipticity and orientation angle on tensile deformation of voided solids in face-centered cubic (FCC) Cu single crystals.…”

Section: Introductionmentioning

confidence: 99%

Plastic deformation of Cu single crystals containing an elliptic cylindrical void

Chen

et al. 2017

Materials Letters

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Molecular dynamics simulations are performed to study the plastic deformation of Cu single crystals containing an elliptic cylindrical void. The effects of initial void geometry including void ellipticity and void orientation angle on plastic deformation are examined by considering the stress-strain response, dislocation nucleation from the void surface, and porosity/void cross-sectional shape evolution. It is found that (i) the initial void geometry plays an important role and (ii) the growth of voids with an increasing initial ellipticity converges to that of a crack. Our results reveal the underlying mechanisms of initial void ellipticity-and orientation angle-dependent plastic deformation of metallic solids, and provide direct evidence that there is no dividing line between a void and a crack in terms of the mechanical responses of these solids.

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Molecular dynamics simulation of healing of an ellipsoid crack in copper under compressive stress

Cited by 9 publications

References 13 publications

Microstructure‐property relation in alumina ceramics during post‐annealing process after laser shock processing

Microstructure‐property relation in alumina ceramics during post‐annealing process after laser shock processing

Multi-Path Nanometric Cutting of Molecular Dynamics Simulation

Plastic deformation of Cu single crystals containing an elliptic cylindrical void

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