Molecular Dynamics Simulation Study on Effect of Process Parameters on Coatings during Cold Spray Process

Joshi, Aneesh; James, Sagil

doi:10.1016/j.promfg.2018.07.026

Cited by 18 publications

(8 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…MD is a computer simulation method that allows for the prediction of time change of atomic or molecular interactions using Newton's equations of motion [84,85]. The basic requirement of MD simulation is that it includes a set of conditions that define the initial locations and velocities of all the particles (atoms), as well as the interaction potential defining the forces in these particles [86].…”

Section: Molecular Dynamics (Md) Methods Descriptionmentioning

confidence: 99%

Recent advances on bonding mechanism in cold spray process: A review of single-particle impact methods

Adaan-Nyiak

Tiamiyu

2022

Journal of Materials Research

View full text Add to dashboard Cite

Cold spray (CS) processing is a layer-by-layer solid-state deposition process in which particles at a temperature below their melting point are launched to sufficiently high velocities to adhere to a substrate (and previously deposited particles), forming coatings/parts. Despite being in existence for over four decades, particle bonding mechanisms in the CS process are unclear due to the complex particle–particle/carrier gas interactions that obscure assessment. This review evaluates recent findings from single-particle impact approaches that circumvent these complexities and further provide new insights on bonding mechanisms. Theories on the evolution of oxide layer breakup and delamination, adiabatic shear instability, jetting, melting, and interface solid-state amorphization that contributes to bonding are assessed and carefully reviewed. Although there is a unified condition in which bonding sets on, this study shows that no singular theory explains bonding mechanism. Rather, dominant mechanism is a function of the prevailing barriers unique to each impact scenario. Graphical abstract

show abstract

Section: Molecular Dynamics (Md) Methods Descriptionmentioning

confidence: 99%

Recent advances on bonding mechanism in cold spray process: A review of single-particle impact methods

Adaan-Nyiak

Tiamiyu

2022

Journal of Materials Research

View full text Add to dashboard Cite

show abstract

“…Molecular dynamics (MD) simulations offer possibilities to understand the CGDS bonding mechanisms at an atomistic level under the conditions of some macro experimental parameters [14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29], which will verify these experimental parameters through pure theoretical methods, without any uncontrollable factor, and optimize or simplify the existing experiments. Higher incident velocities, larger particle sizes and higher temperatures could improve the overall bonding strength between the clusters and substrates, such as the elements Cu and Au [14,15], and Ni and Ti [16].…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulation on the Deposition Characteristics between Pt Cluster and Ni Substrate in Cold Gas Dynamic Spraying

Zhang

Li²,

Shi³

2022

Coatings

View full text Add to dashboard Cite

During the process of cold spraying, the motion behavior and the arrangement of clusters, before impacting the substrate, have great influences on the coating/substrate bonding strength and the coating morphologies. In this work, the scattering and self-rotating movement of a single cluster and the different spatial positions of two clusters were taken into account to analyze the deposition characteristics between Pt clusters and Ni substrate by using the molecular dynamics method. We found that an excessively high normal velocity results in the failure of mechanical interlocking. Meanwhile, the increasing tangential velocity mainly enhances the mechanical interlocking. Moreover, the mechanical interlocking and the metallurgic bonding always are enhanced by increasing the impact torque around x-axis, but the metallurgic bonding increases only if the impact torque around z-axis is beyond a certain value. The results further show that, for the two neighboring clusters arranged horizontally, the thermal-softening effect of the first cluster impacting onto the substrate contributes more to its own metallurgic bonding and the mechanical interlocking of the latter one. In addition, for the two vertical clusters colliding with each other during their flying course, the smaller velocity difference can largely enhance the metal interlocking and the metallurgic bonding by shortening the cooling and solidifying times.

show abstract

“…Their study examined about 2000 atoms for the analysis. The effects of spray parameters on small clusters of up to 400 atoms as model systems were studied by Joshi and James and it was demonstrated that particles seemed to rebound out of the substrate at impact angles exceeding 90 degrees [24,27,28]. Daneshian and Assadi [29] modelled on the interatomic impact of constitutively ductile nanomaterials and identified the particle size effect and speed of impact in the fragmentation, deformation, and rebounding of ductile particles.…”

Section: Introductionmentioning

confidence: 99%

Development of palladium nanoparticles deposition on a copper substrate using a molecular dynamic (MD) simulation: a cold gas dynamic spray process

et al. 2020

View full text Add to dashboard Cite

The objective of this study is to create an ultra-thin palladium foil with a molecular dynamic (MD) simulation technique on a copper substrate surface. The layer formed onto the surface consists of a singular 3D palladium (Pd) nanoparticle structure which, by the cold gas dynamic spray (CGDS) technique, is especially incorporated into the low-cost copper substrate. Pd and Cu have been chosen for their possible hydrogen separation technology applications. The nanoparticles were deposited to the substrate surface with an initial velocity ranging from 500 to 1500 m/s. The particle radius was 1 to 4 nm and an angle of impact of 90° at room temperature of 300 K, in order to evaluate changes in the conduct of deformation caused by effects of size. The deformation mechanisms study revealed that the particle and substrate interface is subject to the interfacial jet formation and adiabatic softening resulting in a uniform layering. However, shear instabilities at high impact speeds were confirmed by the evolution of von Mises shear strain, temperature evolution and plastic strain. The results of this study can be used to further our existing knowledge in the complex spraying processes of cold gas dynamic spray technology.

show abstract

Molecular Dynamics Simulation Study on Effect of Process Parameters on Coatings during Cold Spray Process

Cited by 18 publications

References 10 publications

Recent advances on bonding mechanism in cold spray process: A review of single-particle impact methods

Recent advances on bonding mechanism in cold spray process: A review of single-particle impact methods

Molecular Dynamics Simulation on the Deposition Characteristics between Pt Cluster and Ni Substrate in Cold Gas Dynamic Spraying

Development of palladium nanoparticles deposition on a copper substrate using a molecular dynamic (MD) simulation: a cold gas dynamic spray process

Contact Info

Product

Resources

About