Molecular view of copper deposition chemistry: (Hexafluoroacetylacetonate)Cu(vinyltrimethylsilane) on a Si(100)-2×1 surface

Chemical manipulation of multifunctional hydrocarbons on silicon surfaces

“…3.39 [356], (hfac(Cu)VTMS) and its ligands have distinctly different vibrational signatures easily observable in the infrared experiments. Specifically, the evolution of ν C=C , ν C=O , ν C-H , ν O-H , ν C-C , and ν CF 3 vibrational signatures as a function of experimental conditions can be followed to determine that upon adsorption at room temperature, vinyltrimethylsilane was immediately desorbed into the gas phase as confirmed by the absence of the characteristic absorption bands in the C-H stretching region in the infrared spectra [356]. After considering the stabilities and vibrational signatures of structures A, B, and C in Fig.…”

“…The effect of copper atoms on another bidentate ligand was investigated by Pirolli and Teplyakov [356]. In that study, β-diketonate bound to a copper atom was formed at room temperature on a Si(100)-2×1 by dosing it with (hexafluoroacetylacetonate)Cu(vinyltrimethylsilane) (hfac(Cu)VTMS), a compound used in copper deposition.…”

Metal-based Inkjet Inks for Printed Electronics

“…The key surface characteristics responsible for this behavior are surface roughness, surface energy, and the chemical nature of the surface [186], which includes conductivity, as would be expected for surface deposition processes undergoing redox reactions. In order to facilitate and/or accelerate film growth, surface pre-treatment is usually required.…”

Deposition of copper from Cu(i) and Cu(ii) precursors onto HOPG surface: Role of surface defects and choice of a precursor

“…[18][19][20][21][22] Due to the structural differences of the two precursors, different reactivities and therefore surface morphologies of the structures produced are expected, as has been observed on surfaces such as ZnO, 22 silica, and silicon. 18,20,21 In addition, since the VTMS moiety from Cu(hfac)VTMS is expected to desorb from the substrate immediately upon adsorption, as was observed on several substrates even at room temperature, [20][21][22][23][24][25][26][27] Cu(hfac) is actually expected to be the reactive adsorbate (Figure 1(a)) that will interact with the surface for deposition based on this precursor. Hence, compared to Cu(hfac) 2 (structure in Figure 1(b)), Cu(hfac) is expected to show very different reactivity on a surface of HOPG.…”