Monitoring of SPS Concentration by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution

Tran, Anh Van Nhat; Hoang, Ha; Hirato, Tetsuji; Kondo, Kazuo

doi:10.1149/2.0841914jes

Cited by 10 publications

(6 citation statements)

References 32 publications

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“…The ring potential is kept constant at 0.6 V to oxidize all Cu(I)complexes to Cu 2+ and the transferred electrons are counted as the ring current. 12 However, with the addition of 3 and 5 ppm of 2M5S, the ring current shows detectable decreases while the disk current remains the same. Hence, 2M5S must interact with the Cu(I) complexes to form Cu(I)-2M5S complex, the reactions can be written as follows:…”

Section: Resultsmentioning

confidence: 96%

“…2M5S contains a thiol group and thought to form an analogous complex as Cu(I)thiolate. Moreover, 2M5S also contains the δpolarized Nitrogen atoms, then the bonding strength of Cu(I)−2M5S complex is stronger than Cu(I)thiolate complex 12 and not be oxidized at the ring electrode. That is the reason why the ring current decreases with the addition of 2M5S.…”

Section: Resultsmentioning

confidence: 99%

“…The monitoring methods of PEG and SDDACC have been mentioned elsewhere. 12 Copper pipes were prepared and electrodeposited with the fresh and electrolyzed solution to measure the thermal expansion. An aluminum pipe was used as the cathode.…”

Section: Methodsmentioning

confidence: 99%

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Communication—A Rotating Ring Disk Study to Monitor the Concentration of 2M5S in Copper Low TEC Electrolytes

Tran

Hirato

Kondo

2021

J. Electrochem. Soc.

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A leveller additive, 2-mercapto-5-benzimidazolesulfonic acid (2M5S), is characterized and monitored by cyclic voltammetry stripping (CVS) measurements using a rotating ring disk electrode (RRDE). The ring current gradually decreases with the increase of 2M5S concentration from 1 to 8 ppm. The relationship between the ring current and 2M5S concentration is used for determining the deterioration of the low thermal expansion coefficient (TEC) copper electrodeposition solution. The amount of 2M5S in the 20-hour-electrolyzed solution has been monitored then supplied. The copper pipe electrodeposited with the refreshed solution achieved low TEC, approximately the same as the copper pipe electrodeposited with the fresh solution.

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Section: Resultsmentioning

confidence: 96%

Section: Resultsmentioning

confidence: 99%

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Communication—A Rotating Ring Disk Study to Monitor the Concentration of 2M5S in Copper Low TEC Electrolytes

Tran

Hirato

Kondo

2021

J. Electrochem. Soc.

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“…This study develops a highly sensitive sensor for the detection of organic additives to allow the detection of organic additives for plating production lines. Currently, cyclic voltammetric stripping (CVS) is s used to measure the oxidation peak of copper indirectly to detect the concentration of organic additives [16][17]. Xie et al [18] used CVS with a microelectrode and found that the microelectrode can replace a traditional rotating electrode to monitor the concentration of copper ions and organic additives in metal plating solutions.…”

Section: Introductionmentioning

confidence: 99%

Detection of Organic Additives in Copper Plating Bath Using Voltammetric Methods That Involve a Screen-printed Nano-Au Electrode

Weng

Huang

Wang

et al. 2021

CSIJ

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Three electrochemical methods used to detect organic additives, A, B and C, in acidic plating baths. Cyclic voltammetric stripping (CVS) is used in industry to detect the concentration of organic additives indirectly by measuring the effect of commercial organic additives on the rate of copper deposition. This study directly determines the concentration of organic additives on a screen-printed nano-Au electrode at high potential using three different electrochemical methods: linear scanning voltammetry (LSV), differential pulse voltammetry (DPV) and square wave voltammetry (SWV). The results show that the response currents for the three electrochemical methods exhibit a linear relationship with the concentration of organic additives. The nano-Au electrode is the most sensitive device for the detection of organic additive B using LSV.

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“…Then, the acceleration mechanism was investigated by cyclic voltammetry combined with rotating ring-disk electrode (RRDE). 17 Finally, the filling performances of the two model additives were examined by microvia filling experiments.…”

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confidence: 99%

Function of Sulfhydryl (–HS) Group During Microvia Filling by Copper Plating

Zhao¹,

Pang²,

Wang³

et al. 2020

J. Electrochem. Soc.

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In this work, 3-mercapto-1-propanesulfonate (MPS) with one sulfhydryl (-HS) group and 2,3-dimercapto-1-propanesulfonate (DMPS) with two -HS groups were used as model additives to reveal the function of -HS group during copper plating. Chronopotentiometry was employed to characterize the different electrochemical behaviors of the two model additives. It indicated that DMPS showed stronger accelerating effect than MPS in the plating bath containing Cl − , which could be attributed to its enhanced adsorption caused by two -HS groups. The pre-adsorption and desorption experiments demonstrated the synergistic effects and competitive adsorption between Cl − and the model additives. Moreover, the accelerating mechanism was investigated by cyclic voltammetry combined with rotating ring-disk electrode (RRDE), demonstrating MPS could accelerate the ratedetermining step (RDS) of copper deposition only if Cl − was present, whereas DMPS could enhance the RDS whether Cl − existed or not. Finally, microvia filling experiments were carried out to evaluate the filling performance of the two model additives. The results indicated that in the plating bath containing PEG and Cl − , MPS showed good filling performance, while DMPS did poorly. However, after the introduction of JGB, the filling performance of DMPS was greatly improved, which was resulted from the competitive adsorption between DMPS and PEG being balanced by JGB.

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Monitoring of SPS Concentration by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution

Cited by 10 publications

References 32 publications

Communication—A Rotating Ring Disk Study to Monitor the Concentration of 2M5S in Copper Low TEC Electrolytes

Communication—A Rotating Ring Disk Study to Monitor the Concentration of 2M5S in Copper Low TEC Electrolytes

Detection of Organic Additives in Copper Plating Bath Using Voltammetric Methods That Involve a Screen-printed Nano-Au Electrode

Function of Sulfhydryl (–HS) Group During Microvia Filling by Copper Plating

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