Proceedings of the 2015 International Conference on Microelectronic Test Structures 2015
DOI: 10.1109/icmts.2015.7106123
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Monitoring test structure for plasma process induced charging damage using charge-based capacitance measurement (PID-CBCM)

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(3 citation statements)
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“…Hee-Hwan Ji et al and Moonju Cho et al proposed on-chip CP measurement system with an internal RO in order to protect large gate leakage current in an ultra thin gate oxide [8], [9]. We also proposed the modified CP technique in the plasma process induced charging damage CBCM (PID-CBCM) in the previous work [6]. Specifically, proper DC voltage is applied to Well electrode ofDUT (Vb) as (Vb> Vg), here V g is the gate potential of DUT, so that gate capacitor is applied negative voltage effectively.…”
Section: Modified Charge Pumping (Cp) Techniquementioning
confidence: 99%
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“…Hee-Hwan Ji et al and Moonju Cho et al proposed on-chip CP measurement system with an internal RO in order to protect large gate leakage current in an ultra thin gate oxide [8], [9]. We also proposed the modified CP technique in the plasma process induced charging damage CBCM (PID-CBCM) in the previous work [6]. Specifically, proper DC voltage is applied to Well electrode ofDUT (Vb) as (Vb> Vg), here V g is the gate potential of DUT, so that gate capacitor is applied negative voltage effectively.…”
Section: Modified Charge Pumping (Cp) Techniquementioning
confidence: 99%
“…Similar to the conventional method using an external pulse generator, this technique enables to measure charge pumping current. [6]. When DC voltage as Vb> Vg (gate potential of DUT) was applied to the well electrode of the DUT, the voltage applied to the gate capacitor was effectively negative.…”
Section: Modified Charge Pumping (Cp) Techniquementioning
confidence: 99%
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