Monocrystalline thin-film waferlevel encapsulation of microsystems using porous silicon

Prümm, A.; Kraft, K.-H.; Gottschling, P.; Ahles, Marcus; Armbruster, S.; Metz, M.; Burghartz, Joachim N.

doi:10.1016/j.sna.2012.02.035

Cited by 4 publications

(4 citation statements)

References 7 publications

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“… a Porous etching of the APSM process 144 . b Rearrangement of porous silicon 144 . c Epitaxial growth of membranes 144 .…”

Section: Microsized Pressure Sensor Chipmentioning

confidence: 99%

“…b Rearrangement of porous silicon 144 . c Epitaxial growth of membranes 144 . d SEM of a membrane wafer processed with the APSM process 144 .…”

Section: Microsized Pressure Sensor Chipmentioning

confidence: 99%

“…c Epitaxial growth of membranes 144 . d SEM of a membrane wafer processed with the APSM process 144 . e SoN PC pressure sensor process flow 151 .…”

Section: Microsized Pressure Sensor Chipmentioning

confidence: 99%

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Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Han,

Huang,

et al. 2023

Microsyst Nanoeng

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Pressure sensors play a vital role in aerospace, automotive, medical, and consumer electronics. Although microelectromechanical system (MEMS)-based pressure sensors have been widely used for decades, new trends in pressure sensors, including higher sensitivity, higher accuracy, better multifunctionality, smaller chip size, and smaller package size, have recently emerged. The demand for performance upgradation has led to breakthroughs in sensor materials, design, fabrication, and packaging methods, which have emerged frequently in recent decades. This paper reviews common new trends in MEMS pressure sensors, including minute differential pressure sensors (MDPSs), resonant pressure sensors (RPSs), integrated pressure sensors, miniaturized pressure chips, and leadless pressure sensors. To realize an extremely sensitive MDPS with broad application potential, including in medical ventilators and fire residual pressure monitors, the “beam-membrane-island” sensor design exhibits the best performance of 66 μV/V/kPa with a natural frequency of 11.3 kHz. In high-accuracy applications, silicon and quartz RPS are analyzed, and both materials show ±0.01%FS accuracy with respect to varying temperature coefficient of frequency (TCF) control methods. To improve MEMS sensor integration, different integrated “pressure + x” sensor designs and fabrication methods are compared. In this realm, the intercoupling effect still requires further investigation. Typical fabrication methods for microsized pressure sensor chips are also reviewed. To date, the chip thickness size can be controlled to be <0.1 mm, which is advantageous for implant sensors. Furthermore, a leadless pressure sensor was analyzed, offering an extremely small package size and harsh environmental compatibility. This review is structured as follows. The background of pressure sensors is first presented. Then, an in-depth introduction to MEMS pressure sensors based on different application scenarios is provided. Additionally, their respective characteristics and significant advancements are analyzed and summarized. Finally, development trends of MEMS pressure sensors in different fields are analyzed.

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“… a Porous etching of the APSM process 144 . b Rearrangement of porous silicon 144 . c Epitaxial growth of membranes 144 .…”

Section: Microsized Pressure Sensor Chipmentioning

confidence: 99%

“…b Rearrangement of porous silicon 144 . c Epitaxial growth of membranes 144 . d SEM of a membrane wafer processed with the APSM process 144 .…”

Section: Microsized Pressure Sensor Chipmentioning

confidence: 99%

See 1 more Smart Citation

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Han,

Huang,

et al. 2023

Microsyst Nanoeng

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show abstract

“…The main application during the development phase is the encapsulation of surface micro-machined structures like inertial sensors or gyroscopes on wafer level [16][17][18][19]. It is also applied as a new and effective sealing method in dye-sensitized solar cells and in some other electronic seals [20][21][22]. In terms of glass frit's application in the strain gage attachment process, Leasure et al [6] and Kim et al [7] have verified the feasibility that silicon strain gages can be bonded onto stainless steel (SS) using glass frit.…”

Section: Introductionmentioning

confidence: 99%

Silicon strain gages bonded on stainless steel using glass frit for strain sensor applications

Zhang

Cheng

Leng³

et al. 2014

Meas. Sci. Technol.

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In this paper, a steel pressure sensor using strain gages bonded on a 17–4 PH stainless steel (SS) diaphragm based on glass frit technology is proposed. The strain gages with uniform resistance are obtained by growing an epi-silicon layer on a single crystal silicon wafer using epitaxial deposition technique. The inorganic glass frits are used as the bonding material between the strain gages and the 17–4 PH SS diaphragm. Our results show that the output performances of sensors at a high temperature of 125 °C are almost equal those at room temperature, which indicates that the glass frit bonding is a good method and may lead to a significant advance in the high temperature applicability of silicon strain gage sensors. Finally, the microstructure of the cured organic adhesive and the fired glass frit are compared. It may be concluded that the defects of the cured organic adhesive deteriorate the hysteresis and repeatability errors of the sensors.

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A Thin Film Porous Alumina Vacuum Package Utilizing a Pore Sealing Getter

Maharshi

Agarwal

Mitra

2023

J. Microelectromech. Syst.

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Monocrystalline thin-film waferlevel encapsulation of microsystems using porous silicon

Cited by 4 publications

References 7 publications

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Silicon strain gages bonded on stainless steel using glass frit for strain sensor applications

A Thin Film Porous Alumina Vacuum Package Utilizing a Pore Sealing Getter

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