LEOS 2008 - 21st Annual Meeting of the IEEE Lasers and Electro-Optics Society 2008
DOI: 10.1109/leos.2008.4688605
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Monolithic Ge/Si avalanche photodiode receiver for 10Gb/s 1.3μm application

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Cited by 11 publications
(30 citation statements)
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“…The structure consists of a Si multiplication layer, a Si charge layer, and a Ge absorption layer, which is similar with that in Ref. [3]. The thicknesses and the doping concentrations for all layers are shown in Figure 1(b).…”
Section: Device Structures and Equivalent Circuit Modellingmentioning
confidence: 85%
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“…The structure consists of a Si multiplication layer, a Si charge layer, and a Ge absorption layer, which is similar with that in Ref. [3]. The thicknesses and the doping concentrations for all layers are shown in Figure 1(b).…”
Section: Device Structures and Equivalent Circuit Modellingmentioning
confidence: 85%
“…In contrast, silicon has a low k-value (<0.1), which makes it one of the most promising candidates for APDs that have both high gain and high bandwidth simultaneously. In order to make Si-APDs usable in the infrared regime, a material with a high absorption coefficient in the infrared, like InGaAs [2] or Ge [3][4][5] is used for the absorption layer along with the Si multiplication layer. Ge is attractive since it is possible to fabricate APDs based on a complementary metal-oxidesemiconductor (CMOS) compatible process.…”
Section: Introductionmentioning
confidence: 99%
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“…One approach has been to combine a Ge absorption region with a Si multiplication layer in an SACM APD. [18][19][20] These APDs have achieved comparable to the best III-V compound APDs but not superior, as would have been expected owing to their low k value. The reason is that their high dark current, which arises from the lattice mismatch between Ge and Si, contributes enough to the noise to offset the lower excess noise factor.…”
Section: Introductionmentioning
confidence: 88%
“…At present, III-V compound (e.g. InGaAs, InP) [21,22] and group IV (Ge) [11][12][13][14] semiconductors are the materials of choice for vertically-illuminated NIR PDs, due to their high (>90%) [8] NIR absorption. The ever growing demand and performance requirements in modern systems (such as bit-rate, number of pixels, imaging matrix size, operation and processing speed) [1,8] make it crucial to integrate PDs with supporting circuitry (drivers, amplifiers, processors) on the same chip.…”
Section: Introductionmentioning
confidence: 99%