2016
DOI: 10.7567/apex.9.032202
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Monolithic integration of a suspended light-emitting diode with a Y-branch structure

Abstract: We describe a double-sided process for the monolithic integration of a light-emitting diode (LED) and a Y-branch structure on a GaN-on-silicon platform. The suspended LED and highly confined waveguides are fabricated by silicon removal with back-side thinning of the suspended membrane. When the LED is turned on, part of the light emission is confined by a suspended rectangular waveguide, and the light propagates laterally. The guided light is then coupled into two branching rectangular waveguides and diffracte… Show more

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Cited by 15 publications
(6 citation statements)
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“…The in-plane VLC system is implemented on a 2-inch GaN-on-silicon wafer [21,22], which is thinned to 200-µm thickness for further silicon removal by chemical mechanical polishing. The device layers consist of a ~220-nm-thick p-GaN layer, 250-nm-thick InGaN/GaN MQWs, a ~3.2-µm-thick n-GaN layer, a ~400-nm-thick undoped GaN layer, a ~900-nm-thick Al(Ga)N buffer layer, and a silicon substrate.…”
Section: Methodsmentioning
confidence: 99%
“…The in-plane VLC system is implemented on a 2-inch GaN-on-silicon wafer [21,22], which is thinned to 200-µm thickness for further silicon removal by chemical mechanical polishing. The device layers consist of a ~220-nm-thick p-GaN layer, 250-nm-thick InGaN/GaN MQWs, a ~3.2-µm-thick n-GaN layer, a ~400-nm-thick undoped GaN layer, a ~900-nm-thick Al(Ga)N buffer layer, and a silicon substrate.…”
Section: Methodsmentioning
confidence: 99%
“…And like for on-chip photonic integration the usage of existing standard silicon processing lines can therefore play a central role in cutting production costs for monolithic multicomponent system. The absorption of downward-emitting light by the silicon substrate can be eliminated through the removal of the silicon [21][22][23]. Wang et al showed on-chip photonic integration of p-n junction InGaN/GaN MQW devices and suspended straight waveguides with diverse functionalities on a GaN-on-silicon platform [5,23].…”
Section: Introductionmentioning
confidence: 99%
“…The absorption of downward-emitting light by the silicon substrate can be eliminated through the removal of the silicon [21][22][23]. Wang et al showed on-chip photonic integration of p-n junction InGaN/GaN MQW devices and suspended straight waveguides with diverse functionalities on a GaN-on-silicon platform [5,23]. On-chip optical interconnect between the transmitter and the receiver is able to be obtained through suspended waveguides, which are produced by a combination of silicon removal and backside III-nitride etching techniques.…”
Section: Introductionmentioning
confidence: 99%
“…Figure 3 demonstratesthe light propagation image of the on-chip photonic circuit when the top-left InGaN/GaN MQW-LED operates at a forward voltage of 3.5 V. In addition to the escape cones perpendicular to the wafer surface, suspended InGaN/GaN MQW-LED has many escape cones parallel to the wafer surface, which can couple the emitted light from the InGaN/GaN MQW-LED to form the in-plane light propagation [14,15]. Hence, the in-plane escape cones could be adopted as waveguides to manipulate the light propagation [16].…”
mentioning
confidence: 99%