Monolithic multi-pole converter device for medium power applications

Abstract

This paper presents a monolithic integration approach of a generic power converter (DC/AC or AC/DC (Fig. 1a)). The integration approach is verified for the case of an H-bridge inverter application through 2D simulations. Experimental characterization results are provided for the common anode three-pole chip and for RC-IGBT structures. The work presented in this paper constitutes a continuation for the work previously presented by the same authors [1][2] [3]. The aim of this integration approach is to suppress wire bonds and to have ultra-compact package in order to improve electrical performance as well as reliability of the power modules in medium power applications. S1 S2 a) b) Fig. 1: a) Typical interleaved power converter architecture, b) The H-bridge inverter circuit.

Mixed monolithic-hybrid integration of multiphase power converter: Preliminary evaluation of the 3-chip integration concept

“…The structure of the RC-IGBT was extensively studied in literature [3][4]. Using this device, the authors have recently proposed a vertical quasi-monolithic integration of power converter called two-chip approach as well as an ultra-compact single chip approach [5] aiming at reducing fabrication costs, improving electrical performance and reliability. Different approaches for converter integration were described in literature in order to reach similar objectives.…”