2003
DOI: 10.1109/lawp.2003.819043
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Monolithic Wilkinson power divider on CMOS grade silicon with a polyimide interface layer for antenna distribution networks

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Cited by 9 publications
(9 citation statements)
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“…Dividers are structures of great practical interest [1,2,3]. A current divider has to distribute the complex current on the terminal loads according to the desired current-split ratios and the desired phase differences between the currents.…”
Section: Introductionmentioning
confidence: 99%
“…Dividers are structures of great practical interest [1,2,3]. A current divider has to distribute the complex current on the terminal loads according to the desired current-split ratios and the desired phase differences between the currents.…”
Section: Introductionmentioning
confidence: 99%
“…One of the most significant characteristics with the Wilkinson power divider is that all of its ports can be matched well and hence a good isolation between the output ports can be achieved [1]. Because of these advantages over the other types of power dividers such as T-junction dividers, and resistive dividers, there have been many efforts to realize the Wilkinson structure using MMICs technology [2][3][4] There have been several efforts to fabricate MMICs on silicon because of its advantages over GaAs such as existence of natural oxide, low cost, and high thermal conductivity. However, the use of standard CMOS grade silicon with resistivity typically on the order of 0.5 to 20Ω cm for MMIC applications has been limited by its high loss, especially, at an RF frequency range.…”
Section: Introductionmentioning
confidence: 99%
“…However, the use of standard CMOS grade silicon with resistivity typically on the order of 0.5 to 20Ω cm for MMIC applications has been limited by its high loss, especially, at an RF frequency range. The insertion of polyimide layers between the silicon substrate and circuits [3], or the use of circuits implemented on high resistivity silicon (HRS) (ρ >2500Ω cm) whose aperture regions are removed by micromachining [4] has been reported to suppress the loss coming from the substrate, but these configurations may these would not only degrade package density of circuits, but also make the integration with active devices such as high electron mobility transistors (HEMTs) difficult at the same wafer level.…”
Section: Introductionmentioning
confidence: 99%
“…One of the most significant characteristics of the Wilkinson power divider is that all of its ports can be well matched; hence, a good isolation between the output ports can be achieved [1]. Because of these advantages over the other types of power dividers such as T-junction dividers and resistive dividers, there have been many efforts to realize the Wilkinson structure using MMIC technology [2][3][4].…”
Section: Introductionmentioning
confidence: 99%
“…However, in spite of its low cost and high thermal conductivity, critical characteristics for high-power device operation, the use of standard CMOS-grade silicon with resistivity typically on the order of 0.5 to 20⍀ cm for MMIC applications has been limited by its high loss, especially in the RF frequency range. Suggestions for the reduction of insertion loss attributed to silicon have included the insertion of a polyimide layer between the standard silicon and circuits [3], or the use of circuits implemented on HRS ( Ͼ 2500⍀ cm) whose aperture regions are removed by micromachining [4]. However, these approaches would not only degrade package density of circuits, but would also make integration with active devices such as high- In general, to realize metal circuits on an HRS substrate, an oxide layer (SiO 2 ) must be grown before the metal deposition in order to suppress a DC leakage current.…”
mentioning
confidence: 99%