2016
DOI: 10.1142/s0217984916502535
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Monte Carlo simulation of the influence of pressure and target–substrate distance on the sputtering process for metal and semiconductor layers

Abstract: The energy and the number of particles arriving at the substrate during physical vapor deposition (PVD) are in close relation with divers parameters. In this work, we present the influence of the distance between the target and substrate and the gas pressure in the sputtering process of deposited layers of metals (Cu, Al and Ag) and semiconductors (Ge, Te and Si) for substrate diameter of 40 cm and target diameter of 5 cm. The nascent sputter flux, the flux of the atoms and their energy arriving at the substra… Show more

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Cited by 9 publications
(5 citation statements)
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“…Modern technologies and their components, such as cell phones, laptops, and smartwatches, rely on cutting-edge technology to be manufactured. Therefore, they typically require small parts obtained from miniaturized wafers using thin-film technology [1][2][3][4][5].…”
Section: Introductionmentioning
confidence: 99%
See 2 more Smart Citations
“…Modern technologies and their components, such as cell phones, laptops, and smartwatches, rely on cutting-edge technology to be manufactured. Therefore, they typically require small parts obtained from miniaturized wafers using thin-film technology [1][2][3][4][5].…”
Section: Introductionmentioning
confidence: 99%
“…Deposition using the sputtering approach is a complex task; it is suitable for creating a process model for acquiring the physical values of sputtering. We used a model to simulate the sputtering and transport processes, as in our previous work [1][2][3][4][5].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Several technologies, including the sputtering technique, can be used for producing and disposing of thin films. The properties of the films deposited by the sputtering technique depend on the material and gas used for discharge and deposition parameters such as pressure, target distance, temperature, substrate polarization and chemical composition [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…To understand the phenomena in plasma and ionized gases, we need to have an exact electron swarm parameter for various electronegative gases. Therefore, considerable attention has been consecrated to studying the physical properties of this gas [6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%