Nano Online 2016
DOI: 10.1515/nano.11671_2015.306
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Morphological and SERS Properties of Silver Nanorod Array Films Fabricated by Oblique Thermal Evaporation at Various Substrate Temperatures

Abstract: which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly credited.Aligned silver nanorod (AgNR) array films were fabricated by oblique thermal evaporation. The substrate temperature during evaporation was varied from 10 to 100 °C using a home-built water cooling system. Deposition angle and substrate temperature were found to be the most important parameters for the morphology of fabricated films.Especially, it was found that there exists a critical t… Show more

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Cited by 4 publications
(5 citation statements)
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“…(220), (311), and (222) planes, respectively, which correspond to face-centered cubic Ag. The film has a higher intensity of (111) crystal orientation similar to what is reported by Khare et al [12] and Oh et al [13]. Ag films, therefore the reflectance measured on 500 nm Ag film shows the characteristics of Ag and, only reflectance of 500 nm Ag film is shown.…”
Section: Methodssupporting
confidence: 81%
“…(220), (311), and (222) planes, respectively, which correspond to face-centered cubic Ag. The film has a higher intensity of (111) crystal orientation similar to what is reported by Khare et al [12] and Oh et al [13]. Ag films, therefore the reflectance measured on 500 nm Ag film shows the characteristics of Ag and, only reflectance of 500 nm Ag film is shown.…”
Section: Methodssupporting
confidence: 81%
“…One of the most critical parameters to understand for nanorod arrays is the filling fraction. Small inter-wire spacing often leads to enhanced radiation transport through surface plasmons, which are thought to be the reason for enhanced Raman signals seen by silver nanorods 22 . Figure 4 shows the coupled calculation at the interface between air and Ag NRs with f = 0.1 and 0.3.…”
Section: Resultsmentioning
confidence: 99%
“…Therefore, taking the wafer and without lithography can simply clamp the mask in thin sheet form along with the wafer or substrate and then go for deposition. Thus, it has the advantage of having nothing to do with a coating of photoresist, exposing using UV light, and then developing the pattern after which we go for thin film deposition before the removal of the resist pattern and getting the desired results 93–97 . However, the major drawback of this method is the quality of the pattern which is generally very poor because, no matter how hard one tries, there are always some gaps left between the mask and the substrate which is ultimately the cause of diffused boundary instead of a sharp one as expected in case of conventional mask‐based process (Figure 7).…”
Section: Methods For Fabrication Of Nanogap Structuresmentioning
confidence: 99%
“…Thus, it has the advantage of having nothing to do with a coating of photoresist, exposing using UV light, and then developing the pattern after which we go for thin film deposition before the removal of the resist pattern and getting the desired results. [93][94][95][96][97] However, the major drawback of this method is the quality of the pattern which is generally very poor because, no matter how hard one tries, there are always some gaps left between the mask and the substrate which is ultimately the cause of diffused boundary instead of a sharp one as expected in case of conventional mask-based process (Figure 7). 98 In the case of normal masking, the definition is only decided by the sharpness of the pattern definition of the masking layer which is far superior and there is no loss in sharpness of the edge pattern due to intimate contact between the masking layer and substrate.…”
Section: Shadow Mask Evaporationmentioning
confidence: 99%