Morphology and gas barrier properties of thin SiO_xcoatings on polycarbonate: Correlations with plasma-enhanced chemical vapor deposition conditions

Abstract

Plasma-enhanced chemical vapor deposition of SiOx coatings on thermoplastics provides a viable route for production of transparent composite materials with high fracture toughness and high gas barrier properties, which are important considerations in the food packaging and biomedical device industries. By examining several series of systematically varied SiOx/polycarbonate composites, we have identified design correlations between coating characteristics (thickness, density, surface roughness, and O2 transmission) and deposition conditions (time, power, pressure, and flow rates). Of particular interest is the observation that the thermal activation energy for O2 permeation through these composites increases (by up to 17 kJ/mol) as their barrier efficacy increases.

Conversion of Perhydropolysilazane into a SiOx Network Triggered by Vacuum Ultraviolet Irradiation: Access to Flexible, Transparent Barrier Coatings

“…[5][6][7] Hence, applications range from gas barriers in the packaging industry, [5,7,8] anticorrosive, protective coatings for metal surfaces against water vapor, and oxygen barriers for flexible solar cells, [9,10] multilayer arrangements for applications in electronics, [11] flexible organic light-emitting diodes (OLEDs) [12] and vacuum-insulated panels (VIPs). [13] State of the art for producing such layers are physical vapor deposition (PVD), [14] plasma-enhanced chemical vapor deposition (PECVD), [15,16] reactive sputtering, [17] and sol-gel procedures. [18] Because these techniques may not always be applied to sensitive polymers, alternative processes, preferably ones which can be run at ambient temperature and pressure, need to be developed.…”

Structural, Optical and Electrical Properties of Plasma Deposited Thin Films from Hexamethyldisilazane Compound

“…With increasing applied RF power they show a maximum at 200 W applied power (sample S3). The refractive index is sensitive to film density and chemical stoichiometry, it increases with the increase of either the film density or the content of Si element in the film [16]. Comparing the obtained behavior of refractive index with that of the ratio (Si-N + Si-O)/C-H (Table II), one can observe the good correlation between them.…”

High-barrier films for flexible organic electronic devices

“…For SiO x films on Polyethylene terephthalate (PET) substrate the critical value of the thickness is 70e140 nm. The effect the thickness exhibits on permeability is associated with the nucleation stage and growth mechanism of oxide (Erlat et al, 2000). Another important factor that affects the barrier properties of inorganic films is the growth mechanism.…”

“…Another important factor that affects the barrier properties of inorganic films is the growth mechanism. Studies have shown that a uniform nucleation stage induces growth of uniform film without defects and with improved barrier properties (Erlat et al, 2000).…”