2002
DOI: 10.1002/1521-4095(20020705)14:13/14<961::aid-adma961>3.0.co;2-x
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Morphology and Thermal Stability of Metal Contacts on Crystalline Organic Thin Films

Abstract: The interfacial properties of metal contacts on organic substrates are strongly determined by the preparation conditions of the gold film. A gold–diindenoperylene (DIP) interface has been studied as a model system for metal contacts on organic electronic devices. The Figure juxtaposes the two deposition methods used, whereby only the first method leads to a well‐defined interface with only a slight amount of diffusion of the gold film into the DIP layer.

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Cited by 131 publications
(71 citation statements)
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“…20 As has been demonstrated by radiotracer studies, significant penetration of Ag into DIP thin films occurs upon thermal metal deposition. 20 As has been demonstrated by radiotracer studies, significant penetration of Ag into DIP thin films occurs upon thermal metal deposition.…”
mentioning
confidence: 90%
“…20 As has been demonstrated by radiotracer studies, significant penetration of Ag into DIP thin films occurs upon thermal metal deposition. 20 As has been demonstrated by radiotracer studies, significant penetration of Ag into DIP thin films occurs upon thermal metal deposition.…”
mentioning
confidence: 90%
“…Thin DIP films have been found to exhibit high structural order [10] but also rapid roughening after initial layer-by-layer growth [11][12][13]. Encapsulation of DIP thin films has been employed for increased device stability [14,15], and contact formation as well as electronic structure at contacts [16][17][18][19][20] have been studied. Its molecular orientation on insulators [12,21] and metals [20,22,23] has been measured, and high-resolution transmission electron microscopy (TEM) [24] and scanning tunneling microscopy (STM) [25] images give insight into the molecular arrangement.…”
Section: Introductionmentioning
confidence: 99%
“…It can be seen that there is no diffusion of Ni into the PEN layer, resulting in clear and smooth formation of the Ni/PEN interface. Here, it should be noted that some researchers have reported that metal atoms diffuse into organic layers in the process of the metal evaporation onto organic layers (Tarlov, 1992;Hirose et al, 1996;Ito et al, 1999;Dürr et al, 2002). For example, the metastable atom electron spectroscopy (MAES) spectra of Au on the p-sexiphenyl (6P)/Au system shows that the features of 6P remain even though Au was deposited to about 20 nm thickness (Ito et al, 1999).…”
Section: Ni/pen Films Used As Electrodes In Qc Devicesmentioning
confidence: 93%