Moving reflector type micro optical switch for high-power transfer in a MEMS-based safety and arming system

Cochran, Kevin; Fan, Lawrence; DeVoe, Don L.

doi:10.1088/0960-1317/14/1/019

Cited by 14 publications

(5 citation statements)

References 22 publications

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“…A wide variety of MEMS sensors have been fabricated from silicon-on-insulator (SOI) wafers using deep reactive ionetching (DRIE) of silicon [1,2]. A few examples include microactuators [3], optical switches [4], accelerometers, and nanopositioners [5]. Many more examples are given by Milanović [6] and Wu et al [2].…”

Section: Introductionmentioning

confidence: 99%

Fracture strength characterization for 25 micron and 125 micron thick SOI-MEMS structures

Buchheit¹,

Phinney²

2015

J. Micromech. Microeng.

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MEMS structural devices are often fabricated by bulk-micromachining using a deep reactive ion-etching process (DRIE) for silicon. DRIE creates the high aspect ratio silicon features used as sensors and actuators in MEMS devices. This paper characterizes fracture strength distributions for DRIE etched MEMS test structures with device layer thicknesses of 25 μm and 125 μm using pull-table style strength test structures. The 25 μm thick measurements offered a direct comparison with previous investigations; whereas, the 125 μm thick measurements are unique to this study. The fracture strength distributions measured for 125 μm thick specimens ranged to significantly lower values and had a narrower distribution compared to previous and current 25 μm thick device layer fracture strength distributions. scanning electron microscopy (SEM) and atomic force microscopy (AFM) were used to characterize and correlate surface roughness features with the observed fracture strength measurements. Characterization revealed that although both the 25 μm and 125 μm thick device layer structures predominantly exhibited scalloping sidewall morphology, the 125 μm thick structures transitioned to rougher curtaining sidewall morphology towards the bottom of the device layer. The difference in strength distributions is attributed to this increased roughness present in the curtaining region and on the bottom surfaces of thicker device layers.

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Section: Introductionmentioning

confidence: 99%

Fracture strength characterization for 25 micron and 125 micron thick SOI-MEMS structures

Buchheit¹,

Phinney²

2015

J. Micromech. Microeng.

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“…Por otra parte, para redirigir la señal de entrada al canal uno, el espejo vuelve a dirigir la trayectoria del haz, al mismo tiempo, induciendo una pérdida adicional. Por lo tanto, la distribución de potencia del haz, la rugosidad de la superficie del espejo, la verticalidad del espejo, y las propiedades del material del espejo son las principales causas de pérdida de potencia óptica en el sistema [9].…”

Section: Bunclassified

Dispositivos de conmutación óptica en redes de nueva generación

Gaona

Montenegro

2013

Ingenium Rev. fac. ing.

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Este documento muestra las funcionalidades de dos tipos de conmutadores ópticos: OXC y OADM, utilizando una herramienta de software que simula el comportamiento de cada uno de estos dispositivos desarrollada en Matlab. Se realiza un análisis comparativo entre los diferentes tipos de interruptores ópticos enfatizando en los interruptores ópticos MEMS (2-D y 3D). Se muestran las diferentes configuraciones para las matrices de conmutación en una sola celda, junto con sus principales características, también se muestran los principales problemas de diseño en relación con las cualidades del interruptor óptico: el rendimiento óptico y las funcionalidades electromecánicas. En el caso del diseño óptico, se analiza la pérdida de inserción inducida por la desalineación de la fibra, la reflexión de Fresnel y aspectos relacionados con el micro-espejo, incluido el material de recubrimiento, el grosor, la rugosidad de la superficie, el efecto del espejo en diferentes longitudes de onda y la pérdida de la polarización-dependiente (PDL).

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“…Traditional S&A device can accomplish the safety and arming functions of fuze, but it is not available for small-caliber ammunition because of its large size, many parts and poor anti-overload capability [10][11][12][13]. MEMS S&A device has small size, light weight and good anti-overload capability, it makes more space for conventional fuze to accommodate the multi-sensor detection circuit and the main power supply module, finally the precision and lethality of ammunition is improved [14][15][16][17]. The miniaturization of S&A device takes priority over other tasks [18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Parametric Study of the Centrifugal Insurance Mechanism in MEMS Safety and Arming Device

Wang¹,

W²,

Feng³

et al. 2017

Preprint

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MEMS (Micro-electromechanical Systems) becomes important increasingly due to the smarter and smaller fuze used in OICW (Objective Individual Combat Weapon). MEMS Safety and Arming (S&A) device is employed in different platforms and regions for small caliber projectile. Therefore, it is necessary to make a parametric study of the MEMS S&A device in different apply environments and explore the main sensitive factors of the MEMS S&A device to provide reference for designs. In this paper, based on the MEMS S&A device designed by our term, theory and finite element models are established, and the centrifugal insurance mechanism of the MEMS S&A device is parametric studied under the different speeds, temperature and thickness of the model by nonlinear dynamic method. By comparing the experimental and predicted results, the established FEM model is verified, and the conclusion is that the temperature and the centrifugal force are the main sensitive factors in the centrifugal insurance mechanism. In summary, we can suggest that the application environment, which the MEMS S&A device is suitable for, is the temperature equal to or slightly greater than normal temperature and the rotating speed higher than35000r/min of small caliber projectile.

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Moving reflector type micro optical switch for high-power transfer in a MEMS-based safety and arming system

Cited by 14 publications

References 22 publications

Fracture strength characterization for 25 micron and 125 micron thick SOI-MEMS structures

Fracture strength characterization for 25 micron and 125 micron thick SOI-MEMS structures

Dispositivos de conmutación óptica en redes de nueva generación

Parametric Study of the Centrifugal Insurance Mechanism in MEMS Safety and Arming Device

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