Multi-domain simulation of transient junction temperatures and resulting stress-strain behavior of power switches for long-term mission profiles

Drofenik, U.; Kovačević, Ivana F.; Schmidt, R.; Kolar, Johann W.

doi:10.1109/compel.2008.4634691

Cited by 10 publications

(6 citation statements)

References 11 publications

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“…The relation (9) gives the lifetime model ( ) with a dependence on the stresses, i.e. junction temperature variations (∆ ) and heating duration ( ).…”

Section: Lifetime Estimation and Extrapolation For Low ∆mentioning

confidence: 99%

“…To this end, numerous lifetime models of power electronic devices have been developed. They can be divided in three categories: empirical models [6][7][8], physics-based models [9][10][11][12][13][14][15][16][17][18] and datadriven or stochastic models [19][20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

“…Physics-based lifetime models are driven by physics-offailure (PoF) analyses and can provide a promising alternative to empirical models [5]. These models can be split in two main categories: stress-based models [9][10][11][12] and degradation-based models [13][14][15][16][17][18]. Both types can be used for remaining lifetime prediction and extrapolation from accelerated to the field operating conditions.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Stress-Based Model for Lifetime Estimation of Bond Wire Contacts Using Power Cycling Tests and Finite-Element Modeling

Dornic¹,

Khatir²,

Tran³

et al. 2019

IEEE J. Emerg. Sel. Topics Power Electron.

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In this paper, a lifetime model for bond wire contacts of Insulated Gate Bipolar Transistors (IGBT) power modules is reported. This model is based on power cycling tests obtained under accelerated conditions and a finite element model taking into account the electrical, thermal and mechanical coupling. It allows to estimate the bond-wires lifetime for a large scale of junction temperature swing amplitudes (∆) and stress durations (). To build it, a numerical design of experiment was performed in both high and low stress values (∆). Then, a strain-life curve has been constructed where average strain values on a defined volume around the contact areas between top-metallization and the most exposed bond-wires to fatigue and lift-off have been used. As result, it has been shown that the total strain is linearly dependent with ∆ and power law dependent with. The combination of the strain-life relation and the strain dependency with stress parameters leads to the lifetime relationship. The obtained lifetime model has been satisfactorily validated with some additional experimental points obtained from literature and with a large range of values for. This methodology can easily be replicated to other structures and is quite generic.

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“…The relation (9) gives the lifetime model ( ) with a dependence on the stresses, i.e. junction temperature variations (∆ ) and heating duration ( ).…”

Section: Lifetime Estimation and Extrapolation For Low ∆mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Stress-Based Model for Lifetime Estimation of Bond Wire Contacts Using Power Cycling Tests and Finite-Element Modeling

Dornic¹,

Khatir²,

Tran³

et al. 2019

IEEE J. Emerg. Sel. Topics Power Electron.

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“…Rapid multi-domain physical simulation is the key enabling technology for virtual prototyping and virtual design optimization; simulations are needed to predict the effect that design choices -the choice of components, materials and geometrical design -have on overall system performance. Typical physical domains that are of interest in power electronic systems include electrical parasitics [1,2], EMI [3,4], electric field in high voltage designs [1], thermal [5] and mechanical [6,7]. The speed of these multi-domain simulations is important as it will determine the speed and ease of use of the virtual prototyping process.…”

Section: A Requirements For Virtual Prototyping and Virtual Designmentioning

confidence: 99%

Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems

Evans

Castellazzi

Johnson

2016

IEEE Trans. Power Electron.

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The need for multidisciplinary virtual prototyping in power electronics has been well established however design tools capable of facilitating a rapid, iterative virtual design process do not exist. A key challenge in developing such tools is identifying and developing modelling techniques which can account for 3D, geometrical design choices without unduly affecting simulation speed. This challenge has been addressed in this work using model order reduction techniques and a prototype power electronic design tool incorporating these techniques is presented. A relevant electro-thermal power module design example is then used to demonstrate the performance of the software and model order reduction techniques. Five design iterations can be evaluated, using 3D inductive and thermal models, under typical operating and startup conditions on a desktop PC in less than 15 minutes. The results are validated experimentally for both thermal and electrical domains.

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“…The study of reliability and failure mechanisms of PE systems is a complicated multidisciplinary task [9]. Work concerning the failure and lifetime estimation of PE in different applications has been previously done and various models have been created [9]- [13]. This previous work has identified temperature cycling in the device structure as one of the most critical failure causes in PE systems.…”

Section: Introductionmentioning

confidence: 99%

Lifetime Estimation of Igbt Power Modules for Reliability Study of Wind Turbine Systems

Ahmedi¹,

Barnes²,

Leví³

et al. 2021

IET Conf. Proc.

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In this paper, a method for lifetime estimation of insulated-gate bipolar transistor (IGBT) power electronics (PE) modules in offshore wind turbine (WT) applications is presented. The PE module is studied using a time-series WT simulation model. The WT model employs a detailed representation of the system, including a two-mass representation of the mechanical side, d-q representation of the permanent magnet synchronous generator (PMSG), and an appropriately controlled back-to-back voltagesource converter (BVSC). Additionally, in order to monitor the temperature cycling, a thermal model which considers the losses in an IGBT module has been added. The temperature cycles are counted using a rain flow algorithm and the resulting effect on lifetime is calculated using Miner's rule for damage accumulation. The system is parametrised according to current state-of-theart offshore wind turbine technology.

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Multi-domain simulation of transient junction temperatures and resulting stress-strain behavior of power switches for long-term mission profiles

Cited by 10 publications

References 11 publications

Stress-Based Model for Lifetime Estimation of Bond Wire Contacts Using Power Cycling Tests and Finite-Element Modeling

Stress-Based Model for Lifetime Estimation of Bond Wire Contacts Using Power Cycling Tests and Finite-Element Modeling

Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems

Lifetime Estimation of Igbt Power Modules for Reliability Study of Wind Turbine Systems

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