Multi-functional integrated sensors for the environment

Roozeboom, C. L.; Sim, Joo Yong; Wickeraad, D. A.; Dura, B.; Smith, W. S.; Hopcroft, Matthew A.; Hartwell, P.G.; Williams, R. Stanley; Pruitt, Beth L.

doi:10.1109/memsys.2012.6170114

Cited by 14 publications

(9 citation statements)

References 7 publications

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“…Then a wafer bonding to the backside is implemented to finally seal the cavity [14]. To avoid non-uniform etching depth from the backside in batch wafer process, SOI wafers are utilized, in which the buried oxide layer acts as a built-in etch-stopping layer [13]. However, backside processing plus wafer bonding on SOI wafer will increase the foundry fabrication cost dramatically.…”

Section: Design Strategy For Monolithic Composite Sensormentioning

confidence: 99%

“…), have imposed great challenges in commercializing integrated composite sensor products. In addition, several developed integration techniques utilized double-sided micromachining process [12] and even silicon-on-insulator (SOI) wafers [13], which are not favorable for low-cost mass production for sensing networks. Thus, a design/fabrication platform module with low-cost integrated-process solutions is highly desirable.…”

Section: Introductionmentioning

confidence: 99%

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Monolithic Composite “Pressure + Acceleration + Temperature + Infrared” Sensor Using a Versatile Single-Sided “SiN/Poly-Si/Al” Process-Module

Yang

et al. 2013

Sensors

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We report a newly developed design/fabrication module with low-cost single-sided “low-stress-silicon-nitride (LS-SiN)/polysilicon (poly-Si)/Al” process for monolithic integration of composite sensors for sensing-network-node applications. A front-side surface-/bulk-micromachining process on a conventional Si-substrate is developed, featuring a multifunctional SiN/poly-Si/Al layer design for diverse sensing functions. The first “pressure + acceleration + temperature + infrared” (PATIR) composite sensor with the chip size of 2.5 mm × 2.5 mm is demonstrated. Systematic theoretical design and analysis methods are developed. The diverse sensing components include a piezoresistive absolute-pressure sensor (up to 700 kPa, with a sensitivity of 49 mV/MPa under 3.3 V supplied voltage), a piezoresistive accelerometer (±10 g, with a sensitivity of 66 μV/g under 3.3 V and a −3 dB bandwidth of 780 Hz), a thermoelectric infrared detector (with a responsivity of 45 V/W and detectivity of 3.6 × 107 cm·Hz1/2/W) and a thermistor (−25–120 °C). This design/fabrication module concept enables a low-cost monolithically-integrated “multifunctional-library” technique. It can be utilized as a customizable tool for versatile application-specific requirements, which is very useful for small-size, low-cost, large-scale sensing-network node developments.

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Section: Design Strategy For Monolithic Composite Sensormentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Monolithic Composite “Pressure + Acceleration + Temperature + Infrared” Sensor Using a Versatile Single-Sided “SiN/Poly-Si/Al” Process-Module

Yang

et al. 2013

Sensors

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“…The fundamental transverse resonant frequency f 0 of a free-free beam is given by (1) where E is the Young's modulus, ρ is the mass density of the beam material, and L/b/t are the length/width/thickness of the beam. I a is the area moment of inertia (i.e., bt³/12, for a beam with a rectangular cross-section), m the mass per unit length (i.e.…”

Section: A Principle Of Operationmentioning

confidence: 99%

“…From the simple 1-axis accelerometer, IMUs have evolved to provide 3 degrees-offreedom (DOFs) accelerometer sensing and eventually to 6DOFs modules, including angular rate sensors. In particular, the synergy of multi-DOF inertial sensors turned out to be key in improving the navigation capabilities of inertial modules The trend towards development of multi-DOF modules goes on [1]. On-chip magnetometers are seen as key components to further improve the performance of IMUs and navigation modules.…”

Section: Introductionmentioning

confidence: 99%

Poly-SiGe-based MEMS Xylophone Bar Magnetometer

et al. 2012

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This paper presents the design, fabrication and preliminary characterization of highly sensitive MEMS-based Xylophone Bar Magnetometers (XBMs) realized in imec's polySiGe MEMS technology. Key for our Lorentz force driven capacitively sensed resonant sensor are the combination of reasonably high Q-factor and conductivity of imec's poly-SiGe, our optimized multiphysics sensor design targeting the maximization of the Q-factor in a wide temperature range as well as our proprietary monolithic above-CMOS integration and packaging schemes. Prototypes 3-axis devices were fabricated and characterized. We present optical vibrometer and electrical S-parameter measurements of XBMs performed in vacuum with a reference magnet at increasing sensor separation. The optical oscillation amplitude is well correlated with the magnetic field amplitude. The electrical 2-port measurements, 1 st port as Lorentz force actuator and 2 nd port as capacitive sensor, also reproduces the designed magnetic field dependence. This opens the way towards the on-chip integration of small footprint extremely sensitive magnetometers.

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“…In industry, new commercial sensors like the Analog Devices ADIS16405 and the STMicroelectronics LSM33D combine three-axis gyroscopes, accelerometers, and magnetometers in a single package. In our lab, we have previously developed a multifunctional sensor called MFISes [2][3] that measures ten parameters on a single chip: temperature, humidity, light intensity, pressure, air speed, air flow direction, magnetic field, and three-axis acceleration ( Table 1). MFISes is an ideal platform for crosssensitivity experiments because the sensors are integrated on a single device and experience identical test conditions without gradients or time delay.…”

Section: Introductionmentioning

confidence: 99%

Integrated sensor cross-sensitivity analysis

Roozeboom

Salgado

Hopcroft

et al. 2013

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

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We present data and analysis of sensor crosssensitivities to a range of environmental conditions: temperature, humidity, light intensity, air flow, magnetic field, and acceleration. We used previously developed multifunctional integrated sensors (MFISes) with ten functions on a single chip as the test platform. We quantify the effect of test conditions on sensor offset and sensitivity, examine the fundamental mechanisms of the cross-sensitivities, and compare the performance of different transduction principles. The data and analysis is key to enabling the use of multifunctional sensors and is applicable to general sensor design and operation.

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Multi-functional integrated sensors for the environment

Cited by 14 publications

References 7 publications

Monolithic Composite “Pressure + Acceleration + Temperature + Infrared” Sensor Using a Versatile Single-Sided “SiN/Poly-Si/Al” Process-Module

Monolithic Composite “Pressure + Acceleration + Temperature + Infrared” Sensor Using a Versatile Single-Sided “SiN/Poly-Si/Al” Process-Module

Poly-SiGe-based MEMS Xylophone Bar Magnetometer

Integrated sensor cross-sensitivity analysis

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