Multi-layer ceramic based surface mount device packaging for 1200 V and 1700 V SiC SBD power semiconductors

Jung, Dong Yun; Jang, Hyun Gyu; Cho, Doohyung; Park, Kun Sik; Lim, Jong‐Won; Choi, Yun Hwa; Lee, Yong Ha

doi:10.1109/icce-asia49877.2020.9276963

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Cited by 2 publications

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“…However, the voids below the bottom side of the clip were not diffused easily. The voids remaining under the clip were able to cause electrical discharge, such as corona discharge, arc discharge, and spark discharge [32][33][34][35]. The electrical discharge is generated due to the voids and may cause degradation in reliability with respect to the characteristics of the power module.…”

Section: Discussionmentioning

confidence: 99%

Theoretical and experimental analysis of a venting clip to reduce stray inductance in high‐power conversion applications

et al. 2021

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Section: Discussionmentioning

confidence: 99%

Theoretical and experimental analysis of a venting clip to reduce stray inductance in high‐power conversion applications

et al. 2021

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“…Chip packaging is a core part of semiconductor technology, which has a wide range of applications in aerospace, electric vehicles, industrial control and other fields [1]. With the increases in chip package density and the reductions in chip size, the problem of chip heat dissipation has become a hot research issue, so the packaging technology connecting the chip and the carrier board is also facing great challenges [2].…”

Section: Introductionmentioning

confidence: 99%

Research on Low-Insertion-Loss Packaging Materials for DC-6 GHz Attenuation Chips

Wei,

Yu,

Wei

2024

Electronics

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In the DC-6 GHz band, low-insertion-loss packaging materials were investigated to effectively reduce the heat generated during the working process of the attenuation chip. Based on the working principle of the attenuation chip, when the signal passes through the attenuation chip resistor network, it results in energy loss. This means that the insertion loss of the chip generates heat, which leads to an uneven heat dissipation of the chip and thus functional failure. The microwave characteristics of the packaged joints were investigated using different packaging techniques. The results show that the S21 and S11 of the attenuation chip after nano-silver and Au80Sn20 packaging are optimal in the frequency band of DC-6 GHz, and the insertion loss is low compared with the commonly used packaging materials Sn60Pb40 and Sn96.5Ag3.5, which reduces the heat loss and improves the reliability of the attenuation chip packaging.

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Multi-layer ceramic based surface mount device packaging for 1200 V and 1700 V SiC SBD power semiconductors

Cited by 2 publications

References 9 publications

Theoretical and experimental analysis of a venting clip to reduce stray inductance in high‐power conversion applications

Theoretical and experimental analysis of a venting clip to reduce stray inductance in high‐power conversion applications

Research on Low-Insertion-Loss Packaging Materials for DC-6 GHz Attenuation Chips

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