Multi-objective optimization of a chip-attached micro pin fin liquid cooling system

Radmard, Vahideh; Hadad, Yaser; Rangarajan, Srikanth; Hoang, Cong Hiep; Fallahtafti, Najmeh; Arvin, Charles; Sikka, Kamal; Schiffres, Scott N.; Sammakia, Bahgat

doi:10.1016/j.applthermaleng.2021.117187

Cited by 47 publications

(4 citation statements)

References 34 publications

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“…These confirmation tests play a crucial role in checking the results and validating the conclusions drawn during the analysis phase. According to established criteria, 5,14 the values of the objective functions determined by the Multi-objective Jaya algorithm should differ from those determined by ANSYS Fluent by less than 3%. In this specific case, the percentage error for responses was found to be 0.88% for the maximum chip temperature and 0.815% for pumping power.…”

Section: Confirmation Testmentioning

confidence: 99%

“…In fortifying the validation of our work, we considered insights from various experimental works Radmard et al, 5 Hadad et al, 24 and Ramakrishnan et al, 25 in addition to incorporating findings from Lyu et al's study. These additional experimental investigations featured the utilization of rectangular fins arranged in a linear pin fin pattern.…”

Section: Validation and Comparison Of The Numerical Modelmentioning

confidence: 99%

“…Currently, the siliconinsulated bipolar transistor emits a heat flux in the range of 100-150 W/cm 2 while the highest heat flux reaches 500 W/cm 2 . [4][5][6] Nowadays, insufficient heat dissipation has become a bottleneck for the further shrinkage of electronic devices. Approximately 55% of electronic challenges are caused by the failure of thermal management.…”

Section: Introductionmentioning

confidence: 99%

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Multi‐objective optimization of a Fibonacci phyllotaxis micro pin‐fin heat sink

Shemelash,

Tamrat,

Temesgen

et al. 2024

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There are still significant technical challenges associated with thermal management of electronic devices such as microprocessors. To improve heat dissipation performance of integrated circuits, a new Fibonacci phyllotaxis design of circular micropin fin heat sinks has been developed. To minimize both chip temperature and pumping power, a multi‐objective optimization technique was employed. The effect of design parameters such as phyllotaxis coefficient, pin fin diameter, and pin fin height on response parameters was numerically investigated using the full factorial design of the experiment. Artificial neural network was coupled with MO‐Jaya, to arrive at a Pareto frontier of optimal compromise solutions. The optimal set of design variables were found to be a height of 300 μm, a diameter of 122.6 μm, and a phyllotaxis coefficient of 130 μm with an inlet velocity of coolant 2.263 m/s. The selected optimum design was then investigated numerically, and the outcomes were compared to those predicted by the MO‐Jaya algorithm. The final confirmed response variables were a maximum temperature of 51.6°C and a pumping power of 0.191 W. The results show that the Fibonacci phyllotaxis structure of the micro pin fin heat sink has better heat‐dissipating performance.

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Section: Confirmation Testmentioning

confidence: 99%

Section: Validation and Comparison Of The Numerical Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Multi‐objective optimization of a Fibonacci phyllotaxis micro pin‐fin heat sink

Shemelash,

Tamrat,

Temesgen

et al. 2024

Heat Trans

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“…However, from thermal perspective, all power semiconductor devices act as heat sources dissipating power through electronic packages into printed circuit boards (PCB) and heat sinks. Due to high capability of heat transfer, good temperature uniformity, and no power consumption, heat pipes or cooling fins are widely used for heat dissipation of electronic components [1,2]. In recent years, the size of semiconductor components has typically been reducing.…”

Section: Introductionmentioning

confidence: 99%