Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition: Effect of environmental humidity

Abstract

Capability to print metals at micro/nanoscale in arbitrary 3D patterns at local points of interest will have applications in nano-electronics and sensors. Meniscus-confined electrodeposition (MCED) is a manufacturing process that enables depositing metals from an electrolyte containing nozzle (pipette) in arbitrary 3D patterns. In this process, a meniscus (liquid bridge or capillary) between the pipette tip and the substrate governs the localized electrodeposition process. Fabrication of metallic microstructures using this process is a multi-physics process in which electrodeposition, fluid dynamics, and mass and heat transfer physics are simultaneously involved. We utilized multi-physics finite element simulation, guided by experimental data, to understand the effect of water evaporation from the liquid meniscus at the tip of the nozzle for deposition of free-standing copper microwires in MCED process.

Atomic Force Microscope‐Based Meniscus‐Confined Three‐Dimensional Electrodeposition

“…The effect of mass transport within a small capillary on the measured current density was discussed before (see, for example, ref. ). It was found that diffusion by itself cannot explain the high current density that is achieved in the MCED process.…”

“…The AFM piezo motor had a range of 80 µm in the x and y axes, and 65 µm in the z ‐axis. The RH affected the wettability properties of the surfaces as well as the evaporation rate of water from the liquid bridge, which both influenced the quality of the printed item. Therefore, the AFM was positioned inside an acoustic chamber (PicoIC, Molecular Imaging, Phoenix, AZ, USA), which served as an environment chamber, maintaining constant RH of 60–70%.…”

“…The meniscus‐confined electrodeposition (MCED) process, also known as electrochemical fountain pen nanofabrication, is an electrodeposition process that relies on an electrolyte‐containing deposition tool (or electrolyte reservoir), typically in the form of a micropipette with a micron/submicron‐size dispensing tip. When the micropipette approaches vertically the vicinity of a surface of a conductive substrate, a meniscus is established between the tip and the surface . Electrical potential (or current), applied between a small conductive wire inside the pipette and the conductive substrate via the meniscus, causes reduction of the reducible material on the surface confined by the meniscus.…”

Development of a Cone CVT by SDPD and Topology Optimization

“…Scholars have tried to avoid/diminish these defects by controlling the controllable process parameters such as laser specifications or control the fabrication signatures such as melting pool specifications during the fabrication process [20,29]. A number of scholars also attempted to derive the optimized process parameters even before printing a part by studying the effects of different parameters on the fabrication process through multi-physics simulation of the printing process [30,31]. This paper studied the theoretical aspects and the design possibilities of the new cone CVT.…”

The Characteristics of Selective 3D Metal Additive Process Using Electrochemical Deposition and Nozzle Fluid Dynamics

“…However, a low process rate (∼100 nm/s) is a critical disadvantage for FIGURE 1 | Schematic diagram of the electroplating system, in which the small letters denote the following: (A) concept of 3D printing by the electrochemical method with an electrolyte jet; (B) experimental setup; (C) photo of the actual experimental configurations. mass production (Morsali et al, 2017). Electro-nanowiring has been studied extensively; however, it can only be utilized to provide 2D patterns (Ahn et al, 2011;Wei and Dong, 2013;Xu et al, 2014;Jiang et al, 2018).…”