Multi-stack Technique for a Compact and Wideband EBG Structure in High-Speed Multilayer Printed Circuit Boards

Abstract

We propose a novel multi‐stack (MS) technique for a compact and wideband electromagnetic bandgap (EBG) structure in high‐speed multilayer printed circuit boards. The proposed MS technique efficiently converts planar EBG arrays into a vertical structure, thus substantially miniaturizing the EBG area and reducing the distance between the noise source and the victim. A dispersion method is presented to examine the effects of the MS technique on the stopband characteristics. Enhanced features of the proposed MS‐EBG structure were experimentally verified using test vehicles. It was experimentally demonstrated that the proposed MS‐EBG structure efficiently suppresses the power/ground noise over a wideband frequency range with a shorter port‐to‐port spacing than the unit‐cell length, thus overcoming a limitation of previous EBG structures.

Signal integrity analysis of system interconnection module of high‐density server supporting serial RapidIO

“…In , a rectangular patch and vertical vias were used to suppress coupling noise formed from ground and power planes.…”