Multifunctional system integration in flexible substrates

Bock, Karlheinz; Yacoub-George, Erwin; Hell, Waltraud; Drost, A.; Wolf, Helmut; Bollmann, D.; Landesberger, Christof; Klink, G.; Gieser, H.; Kutter, Christoph

doi:10.1109/ectc.2014.6897489

Cited by 9 publications

(3 citation statements)

References 4 publications

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“…Polyimide, as well as BCB, can be applied by spin coating, resulting in thin layers with homogenous thicknesses [ 13 , 14 , 15 ]. Openings in the polymeric layer can be established by laser drilling [ 10 , 16 , 17 , 18 , 19 ] or photolithography [ 20 , 21 , 22 ]. Afterwards, conductive tracks are applied.…”

Section: Introductionmentioning

confidence: 99%

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

et al. 2021

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This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The contact pads are opened by photolithography using UV direct light exposure. Circular and rectangular openings of 90 µm and 130 µm diameter, respectively, edge length are realized. Commercial inks containing nanoparticular silver and gold are inkjet printed to form conductive tracks between daisy chain structures. Different numbers of ink layers are applied. The track resistances are characterized by needle probing. Silver ink shows low resistances only for multiple layers and 90 µm openings, while gold ink exhibits low resistances in the single-digit Ω-range for minimum two printed layers.

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Section: Introductionmentioning

confidence: 99%

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

et al. 2021

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“…After silicon thinning, the chips are detached from the wafer release foil and assembled either by face-down flip-chip technology [ 9 , 10 , 11 ] or face-up die-bonding with subsequent electrical contacting [ 12 , 13 , 14 , 15 ]. There are various disadvantages of flip-chip assembly in regard to ultrathin chips.…”

Section: Introductionmentioning

confidence: 99%

Feasibility Study of an Automated Assembly Process for Ultrathin Chips

et al. 2020

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This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.

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“…The performance of organic and inorganic electronics on bendable substrates and plastic foils are discussed in both [29] and [30]. In these studies electronic performance was observed to decrease at a bending radius of 5mm; resistivity at the same bending radius only changed by 5% [29]. Piezoelectric flexible tactile sensors printed on ultrathin polyimide were constructed in [31].…”

Section: Robot Skin Manufacturing Technologymentioning

confidence: 99%