“…Moreover, the rapid advancement of AWG technology has led to the diversification of material platforms used for its fabrication, including silicon [18,19], silica [20,21], SiN [22][23][24], InP [25], LNOI [3,26], and polymers [15,27]. Additionally, the application of AWG is not limited to individual devices anymore, as it can be integrated on-chip with other components, such as optical frequency combs [28], micro-ring resonators [29,30], and others. This allows AWG to achieve more versatile functionalities and further expand its two-dimensional and even three-dimensional integration approaches [28,31].…”