2010
DOI: 10.1021/la100960z
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Multilevel Self-Aligned Microcontact Printing System

Abstract: A multilevel microcontact printing (μCP) system that avoids the use of optical alignment and precision manipulation equipment is demonstrated. Most of the complexity is transferred to the poly(dimethylsiloxane) (PDMS) stamp itself by forming the features, a mechanical self-alignment mechanism, and an elastic membrane by wafer scale replica molding on a Si master. Flexible 50-μm-thick photoetched stainless steel sheets are bonded to PDMS prior to demolding to improve the mechanical stability. The Si master itse… Show more

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Cited by 9 publications
(13 citation statements)
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“…DCP can potentially be scaled up to pattern high-throughput, large-scale paper substrates by substituting the serial debossing method used here with a rotary debossing method as well as increasing the length of the printing roller and printing speed. Although DCP may not accommodate large, recessed areas due to unwanted contact with the inked roller, this limitation should be remedied by incorporating nonfunctional support structures, which is a strategy that has been used in microcontact printing to prevent roof collapse of soft polymer stamps. , Continued refinement of DCP will focus on quantifying key parameters of the ink formulation (viscosity, ink loading, and surface tension), exploring different types of paper substrates (density, thickness, hydrophobicity, roughness, and sheer strength), and optimizing printing process parameters such as the stiffness of the printing roller and printing speed. Developing DCP for the fabrication of multilayered devices, including those that incorporate different patterns, is an important future direction for this work as well as exploring other types of substrates beyond paper that can be debossed.…”
Section: Discussionmentioning
confidence: 99%
“…DCP can potentially be scaled up to pattern high-throughput, large-scale paper substrates by substituting the serial debossing method used here with a rotary debossing method as well as increasing the length of the printing roller and printing speed. Although DCP may not accommodate large, recessed areas due to unwanted contact with the inked roller, this limitation should be remedied by incorporating nonfunctional support structures, which is a strategy that has been used in microcontact printing to prevent roof collapse of soft polymer stamps. , Continued refinement of DCP will focus on quantifying key parameters of the ink formulation (viscosity, ink loading, and surface tension), exploring different types of paper substrates (density, thickness, hydrophobicity, roughness, and sheer strength), and optimizing printing process parameters such as the stiffness of the printing roller and printing speed. Developing DCP for the fabrication of multilayered devices, including those that incorporate different patterns, is an important future direction for this work as well as exploring other types of substrates beyond paper that can be debossed.…”
Section: Discussionmentioning
confidence: 99%
“…Most of the thin-film layers can be deposited by conventional deposition methods such as sputtering. The polymer active layer can be transferred to the PMMA substrate using soft lithography technologies such as microcontact printing, 28 while following the topography in the PMMA substrate.…”
Section: Device Structures and Analytical Methodsmentioning
confidence: 99%
“…For μCP experiments, the stamp and substrates were arranged as in figure 1. The top face of the stamp was inked with 1hexadecanethiol (as described in [33]), whilst the Au coated glass substrate was placed on the stamp spacer and held in position by the lid. In this configuration, the flying height, s, is 190 μm.…”
Section: Contact and μCp With A Hydraulic Drivementioning
confidence: 99%