“…DCP can potentially be scaled up to pattern high-throughput, large-scale paper substrates by substituting the serial debossing method used here with a rotary debossing method as well as increasing the length of the printing roller and printing speed. Although DCP may not accommodate large, recessed areas due to unwanted contact with the inked roller, this limitation should be remedied by incorporating nonfunctional support structures, which is a strategy that has been used in microcontact printing to prevent roof collapse of soft polymer stamps. , Continued refinement of DCP will focus on quantifying key parameters of the ink formulation (viscosity, ink loading, and surface tension), exploring different types of paper substrates (density, thickness, hydrophobicity, roughness, and sheer strength), and optimizing printing process parameters such as the stiffness of the printing roller and printing speed. Developing DCP for the fabrication of multilayered devices, including those that incorporate different patterns, is an important future direction for this work as well as exploring other types of substrates beyond paper that can be debossed.…”