“…Among various materials, Parylene-C (PA) is one of the most prevailing packaging materials for biomedical implants [ 14 , 15 , 16 , 17 , 18 ]. SiO 2 [ 19 , 20 , 21 , 22 ], and Si 3 N 4 [ 23 , 24 , 25 ] are usually used as insulating layers in silicon based neural probes as well as an encapsulation protective layer to protect microelectronics from corrosive environments such as body fluids. However, the packaging performances of these films have not been studied systematically.…”