2016
DOI: 10.1016/j.solmat.2016.06.034
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n-Type polysilicon passivating contact for industrial bifacial n-type solar cells

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Cited by 143 publications
(83 citation statements)
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“…The lower active dopant concentration within the poly-Si(p + ) layer can be partially attributed to the lower doping efficiency of boron atoms than phosphorus atoms [67] based on the theoretical prediction of impurity formation energies and partially attributed to the higher diffusivity of the boron dopants [68] into the silicon bulk which resulted in a deeper boron-diffused junction (see Figure 7). Similar to other reports [65], we also observed experimentally that it is preferable to concentrate all the dopants within the poly-Si layers, as the out-diffusion of dopants is expected to lead to increased surface recombination rates and a corresponding drop in the overall passivation quality as well. Table 2 summarizes our measured passivation quality results on planar symmetrical lifetime test structures with the optimized doped poly-Si(n + ) capping layers on various investigated tunnel oxide candidates (i.e., wet-SiO x , ozone-SiO x , thermal-SiO x ).…”
Section: Screening Lpcvd Poly-si Capping Layers For Contact Passivationsupporting
confidence: 90%
See 1 more Smart Citation
“…The lower active dopant concentration within the poly-Si(p + ) layer can be partially attributed to the lower doping efficiency of boron atoms than phosphorus atoms [67] based on the theoretical prediction of impurity formation energies and partially attributed to the higher diffusivity of the boron dopants [68] into the silicon bulk which resulted in a deeper boron-diffused junction (see Figure 7). Similar to other reports [65], we also observed experimentally that it is preferable to concentrate all the dopants within the poly-Si layers, as the out-diffusion of dopants is expected to lead to increased surface recombination rates and a corresponding drop in the overall passivation quality as well. Table 2 summarizes our measured passivation quality results on planar symmetrical lifetime test structures with the optimized doped poly-Si(n + ) capping layers on various investigated tunnel oxide candidates (i.e., wet-SiO x , ozone-SiO x , thermal-SiO x ).…”
Section: Screening Lpcvd Poly-si Capping Layers For Contact Passivationsupporting
confidence: 90%
“…The optimization goal is to incorporate as much active dopants within the poly-Si layers as possible while reducing or avoiding the out-diffusion of dopants into the c-Si wafer bulk, which will increase the surface recombination rates and reduce the device performance, as also reported in Ref. [65].…”
Section: Screening Lpcvd Poly-si Capping Layers For Contact Passivationmentioning
confidence: 99%
“…Furthermore, it is crucial that defects at the c-Si/SiO x interface are passivated. This can be achieved by hydrogenating the poly-Si layer by means of hydrogen plasma treatments [55] or by capping the poly-Si layer with Al 2 O 3 [56] or SiN x [57]. The band diagram that visually illustrates the working mechanism of an electron-selective passivating contact based on n-type poly-Si is shown in Fig.…”
Section: A Si-based Materialsmentioning
confidence: 99%
“…Such hydrogenation can be realized by exposing the poly-SI films to a remote hydrogen plasma, 27 or alternatively, by capping the poly-Si by thin films of Al 2 O 3 or SiN x followed by thermal annealing. [28][29][30][31] In this work, we adopted a similar approach as the poly-Si case to investigate surface passivation by highly transparent and conductive ZnO films. Specifically, we explore the use of an ultra-thin interface oxide and an Al 2 O 3 capping layer to achieve surface passivation by highly-doped ZnO films that are prepared by atomic layer deposition (ALD).…”
Section: Introductionmentioning
confidence: 99%