Abstract:Fast jeder Computer ist heute mit einem dynamic RAM ausgerüstet, einem Speicherbaustein, der die gespeicherten Daten alle paar Millisekunden elektronisch wiederauffrischen muss. Dieses Konzept ist nicht optimal, aber die Bausteine sind billig. Die Zukunft jedoch gehört den nichtflüchtigen Speichern. Neue Verfahren der Mikrostrukturphysik machen es jetzt möglich, dünne ferroelektrische Schichten und Nanostrukturen in die Silizium‐Technologie zu integrieren und fehlerfrei auszulesen.
“…on Pt/TiO 2 /SiO 2 /Si or Ir/TiO 2 /SiO 2 /Si [67,100,101]) only leads to local epitaxial growth of the ferroelectric films on the substrates. Wafer bonding provides a possibility to deposit epitaxial layers on appropriate substrates and subsequently to transfer the epitaxial structures on Si wafers [7].…”
“…on Pt/TiO 2 /SiO 2 /Si or Ir/TiO 2 /SiO 2 /Si [67,100,101]) only leads to local epitaxial growth of the ferroelectric films on the substrates. Wafer bonding provides a possibility to deposit epitaxial layers on appropriate substrates and subsequently to transfer the epitaxial structures on Si wafers [7].…”
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