2021
DOI: 10.1021/acsami.1c03895
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Nano-Laminated Metal Oxides/Polyamide Stretchable Moisture- and Gas-Barrier Films by Integrated Atomic/Molecular Layer Deposition

Abstract: Stretchable barrier films capable of maintaining high levels of moisture- and gas-barrier performance under significant mechanical strains are a critical component for wearable/flexible electronics and other devices, but realization of stretchable moisture-barrier films has not been possible due to the inevitable issues of strain-induced rupturing compounded with moisture-induced swelling of a stretched barrier film. This study demonstrates nanolaminated polymer/metal oxide stretchable moisture-barrier films f… Show more

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Cited by 19 publications
(30 citation statements)
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“…245 [259] Bdy 1,4-Butynediol 50 [258] 4,4′-BPDC 4,4′-Biphenyldicarboxylic acid 250 [106] Aconitic acid 114 [234] 1,3-BDC 1,3-Benzenedicarboxylic acid 212 [114] EA Ethanolamine 80 [260,261] 1,3,5-BTC 1,3,5-Benzenetricarboxylic acid 245 [205] MC Malonyl chloride RT, [262] 28 [261] AZO 4,4′-Azobenzenedicarboxylic acid 310 [134,263] Lactic acid 115 [264] Cur Curcumin 260 [135,265] Pimelic acid 139 [221] 1,4-NDC 1,4-Naphthalenedicarboxylic acid 200 [266] DEG Diethylene glycol 100 [267] ADA 9,10-Anthracenedicarboxylic acid 240 [266] HD 1,6-Hexanediol 85 [125] Qz Quinizarin 130 [268] DD 1,10-Decanediol 120 [269] BDS 1,4-Benzenedisulfonic acid 190 [121] H 4 Pe Pentaerythritol 160 [268] DHTP 2,5-Dihydroxyterephthalic acid 190 [270] PD 1,3-Propanediol 100 [271] PMDA 1,2,4,5-Benzenetetracarboxylic anhydride 150 [209] l-Cys l-Cysteine [217,272] Abbreviation Full name (ring-opening) Source temperature [°C] l-Ala l-Alanine [217] Phenol 80 [273,274] l-Lys l-Lysine [217] 3F 3-(Trifluoromethyl)phenol 80 [273,274] Malonic acid 125 [221] 4F 2-Fluoro-4-(trifluoromethyl)benzaldehyde 60 [273,274] l-aspartic acid 225 [210] GLY Glycidol 60 [275,…”
Section: Brief Account Of Ald/mld Processes Developedmentioning
confidence: 99%
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“…245 [259] Bdy 1,4-Butynediol 50 [258] 4,4′-BPDC 4,4′-Biphenyldicarboxylic acid 250 [106] Aconitic acid 114 [234] 1,3-BDC 1,3-Benzenedicarboxylic acid 212 [114] EA Ethanolamine 80 [260,261] 1,3,5-BTC 1,3,5-Benzenetricarboxylic acid 245 [205] MC Malonyl chloride RT, [262] 28 [261] AZO 4,4′-Azobenzenedicarboxylic acid 310 [134,263] Lactic acid 115 [264] Cur Curcumin 260 [135,265] Pimelic acid 139 [221] 1,4-NDC 1,4-Naphthalenedicarboxylic acid 200 [266] DEG Diethylene glycol 100 [267] ADA 9,10-Anthracenedicarboxylic acid 240 [266] HD 1,6-Hexanediol 85 [125] Qz Quinizarin 130 [268] DD 1,10-Decanediol 120 [269] BDS 1,4-Benzenedisulfonic acid 190 [121] H 4 Pe Pentaerythritol 160 [268] DHTP 2,5-Dihydroxyterephthalic acid 190 [270] PD 1,3-Propanediol 100 [271] PMDA 1,2,4,5-Benzenetetracarboxylic anhydride 150 [209] l-Cys l-Cysteine [217,272] Abbreviation Full name (ring-opening) Source temperature [°C] l-Ala l-Alanine [217] Phenol 80 [273,274] l-Lys l-Lysine [217] 3F 3-(Trifluoromethyl)phenol 80 [273,274] Malonic acid 125 [221] 4F 2-Fluoro-4-(trifluoromethyl)benzaldehyde 60 [273,274] l-aspartic acid 225 [210] GLY Glycidol 60 [275,…”
Section: Brief Account Of Ald/mld Processes Developedmentioning
confidence: 99%
“…Zirconium-based ALD/MLD films have been deposited from ZrCl 4 , [106,122,204,224,416] and also from tetrakis(dimethylamido) (TDMA)- [65] and tetra-tert-butoxide (ZTB)- [126,230,[417][418][419] based precursors together with a variety of different organic precursors. Likewise, Hf-based films have been deposited from TDMAH, [230,262,324,420] HfCl 4 , [122] and TEMAH [367] together with various organics. In the few additional studies involving the 4d or 5d transition metals, Nb-based films have been deposited from Nb(OEt) 5 in combination with HQ, [421] Mo-based films from molybdenum hexacarbonyl together with 1,2-ethanedithiol (EDT), [242,243] 1,4-butanedithiol, and BDT, [243] and In-based films from bis(trimethylsilyl)amidodiethylindium (INCA-1) and HQ.…”
Section: D-and 5d-transition-metal-based Processesmentioning
confidence: 99%
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“…If the ALD-Al 2 O 3 monolayer film has better flexibility to achieve independent flexible encapsulation performances, it would undoubtedly reduce the preparation process and realize ultra-flexible optoelectronic devices. 25–27…”
Section: Introductionmentioning
confidence: 99%