Nano-structure Control of Leadframe Surface to Achieve Robust Juncture with Epoxy Resin

Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules–Metal Composite Interface

“…Then, epoxy resin (Hitachi Chemical CEL‐9221HF10G) was inserted and pressed at 12 MPa pressure for 100 s to prepare sample sheet. To fully cure the as‐prepared sample sheet, the sheet was heated in oven at 175 °C for 5 h. The bonding strength of LF with epoxy resin was measured in terms of the maximum load upon peeling‐off the resin part of the sample piece horizontally at 500 μm/s by microtester (DAGE PC2400) .…”

“…In the previous study on the bonding strength of Pd‐PPF, it was reported that a roughened surface enhances the bonding strength . Thus, we formed and controlled the surface nanostructure, achieving improved bonding strength . On the other hand, there are only a few reports on chemically enhancing bonding force of interface.…”

“…. An IC chip is fixed on leadframe (denoted as LF hereafter), which are connected by gold wire for electric conduction and sealed with epoxy resin as a unit . Higher density installment is required for semiconductors for high functionalization, downsizing, and weight reduction of electronic devices, while the package structure is becoming thinner, smaller, versatile, and complex .…”