2019
DOI: 10.1016/j.spmi.2018.04.038
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Nanocrack formation due to inverse piezoelectric effect in AlGaN/GaN HEMT

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Cited by 13 publications
(10 citation statements)
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“…In the same year, Whiting et al [33] reported the formation of nanocracks underneath the ohmic metal contacts of GaN HEMTs. Wet etches are done to remove the ohmic contacts of electrically stressed devices, and it is found that the observed nanocracks orient along the [11][12][13][14][15][16][17][18][19][20] directions.…”
Section: High Electric Stressmentioning
confidence: 98%
See 1 more Smart Citation
“…In the same year, Whiting et al [33] reported the formation of nanocracks underneath the ohmic metal contacts of GaN HEMTs. Wet etches are done to remove the ohmic contacts of electrically stressed devices, and it is found that the observed nanocracks orient along the [11][12][13][14][15][16][17][18][19][20] directions.…”
Section: High Electric Stressmentioning
confidence: 98%
“…Before stress (e) Aluminium oxidation at a pit [31] . A nanocrack extending from a TiN metal inclusion into the channel area [33] . The substrate is completely damaged at last [19] .…”
Section: High Electric Stressmentioning
confidence: 99%
“…The bariumtitanate pickups were born in the 1940s, while the lead zirconate titanates were successfully developed in the 1950s. Since then, the piezoelectric ceramics have entered a new stage of development [4]. The piezoelectric ceramics experience continuous improvements, the binary, ternary and quaternary piezoelectric ceramics came into being [5].…”
Section: Introductionmentioning
confidence: 99%
“…The HEMT technology based on aluminium gallium nitride (AlGaN)/gallium nitride (GaN) hetero interface are appealing for power-switching, high temperature and millimeter-wave applications because this device has an excellent electronic properties, such as high breakdown field, high mobility and high sheetcarrier density of the two-dimensional electron gas (2-DEG [5], [6] comparing with conventional HEMTs devices [7], [8]. Despite the interesting characteristics of the HEMTs transistors, there are many parasitic effects which severely limits the direct-current characteristics and the radio-frequency performance of AlGaN/GaN-based HEMTs, such effects include current collapse, gate and drain lag, self-heating effects, the trapping effects.…”
Section: Introductionmentioning
confidence: 99%