2007
DOI: 10.1109/ted.2007.895868
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Nanocrystal Memory Cell Integration in a Stand-Alone 16-Mb nor Flash Device

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Cited by 18 publications
(12 citation statements)
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“…In 2007, STMicroelectronics reported on the fabrication of 16 Mb NOR-type NFGM devices. [39,40] The charge-trapping element consisted of silicon nanocrystals deposited by means of CVD. They investigated how the nanocrystal size and distribution affected the V th distribution and device reliability.…”
Section: Silicon-based Nfgm Devicesmentioning
confidence: 99%
“…In 2007, STMicroelectronics reported on the fabrication of 16 Mb NOR-type NFGM devices. [39,40] The charge-trapping element consisted of silicon nanocrystals deposited by means of CVD. They investigated how the nanocrystal size and distribution affected the V th distribution and device reliability.…”
Section: Silicon-based Nfgm Devicesmentioning
confidence: 99%
“…However, the NCM technologies developed to date still face the concern of producing high-density of uniformly distributed size-homogeneous NCs and hence, cannot avoid fluctuations in device performance and fail to exploit size-dependence effects [2,[5][6][7][8]. While more research is needed to overcome these limitations and other concerns related to the dielectric materials and device architecture [5][6][7], the NCM approach still competes with other charge storage (e.g. SONOS) and non-charge storage (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…Among the different technological routes explored the last few years for generating NCs in the gate oxide of MOS devices, two major techniques have been utilized, namely deposition in vacuum like low-pressure chemical vapor deposition (LPCVD, see e.g. [5,6] and references therein), and ion beam synthesis (IBS) [23,24]. The latter technique has received substantial attention due to its flexibility, manufacturing advantages and full compatibility with standard CMOS technology.…”
Section: Introductionmentioning
confidence: 99%
“…Silicon nanocrystal (Si-NC) memories are one of the most promising solutions to push the scaling limits of Flash memories at least to the 32-20 nm technology nodes [1][2][3][4][5][6]. Due to their discrete nature, Si-NCs are robust to defects in the oxide.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, it should be stated that to date, the promising performances of Si-NC memories have been mainly demonstrated on single cells or medium-sized arrays (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16) [1][2][3][4][5][6]. An extensive set of experiments, including performance and reliability data of large-scale integrated memories should still be provided.…”
Section: Introductionmentioning
confidence: 99%