Nanoimprint Lithography Simulation of the Polymer Chains (CH<SUB>2</SUB>)<SUB><I>n</I></SUB> with Anti-Adhesion Layer on Stamp by Molecular Dynamics Method

Abstract

This paper aims at the study of nanoimprint lithography (NIL) of the polymer material in (CH 2 ) n chains using molecular dynamics (MD) simulation method. The effects of the stamp tip width, temperature and spring back were examined for stamps with and without anti-adhesion layer, a selfassembled monolayer (SAM). The MD simulation codes were built to simulate material deformation behaviors at atomic scale. The deformation mechanism of NIL using silicon stamp without SAM anti-adhesion layer coating was first studied, and then simulations of the NIL processes with SAM coating were done to compare with those without SAM anti-adhesion layer. NIL at three different temperatures, 0 K, 273 K and 300 K, were studied to understand the temperature effects on NIL. Without SAM coating on the stamp, adhesion of polymer chains to the stamp tip occurred at 273 K and 300 K. This adhesion problem prevented the pattern from being successfully transferred. With the stamp tip coated with SAM, however, by reducing the stamp tip width and increasing imprinting depth the adhesion problem can be avoided to ensure successful pattern transfer.