Nanoindentation of lead-free solders in microelectronic packaging

Liu, C.Z.; Chen, Jian

doi:10.1016/j.msea.2006.10.056

Cited by 43 publications

(17 citation statements)

References 19 publications

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“…Nanoindentation is increasingly becoming the technique of choice to assess the mechanical behavior of tiny materials, particularly to measure the strain rate sensitivity exponent [12,[15][16][17][18][19][20][21][22][23][24]. Different types of nanoindentation loading conditions are often used to determine the relationship between the indentation strain rate and hardness, including constant rate of loading (CRL), constant load and hold (CLH), constant strain rate (CSR), and strain rate jump (SRJ) nanoindentations [20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Strain-Rate Sensitivity of Selective Laser Melted H13 Tool Steel Using Nanoindentation Tests

Nguyen

Kim

Lee

et al. 2018

Metals

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This paper demonstrates the successful printing of H13 tool steel by a selective laser melting (SLM) method at a scan laser speed of 200 mm/s for the best microstructure and mechanical behavior. Specifically, the nanoindentation strain-rate sensitivity values were 0.022, 0.019, 0.027, 0.028, and 0.035 for SLM H13 at laser scan speeds of 100, 200, 400, 800, and 1600 mm/s, respectively. This showed that the hardness increases as the strain rate increases and, practically, the hardness values of the SLM H13 at the 200 mm/s laser scan speed are the highest and least sensitive to the strain rate as compared to H13 samples at other scan speeds. The SLM processing of this material at 200 mm/s laser scan speed therefore shows the highest potential for advanced tool design. Residual stress is expected to affect the hardness and shall be investigated in future research.

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Section: Introductionmentioning

confidence: 99%

Evaluation of Strain-Rate Sensitivity of Selective Laser Melted H13 Tool Steel Using Nanoindentation Tests

Nguyen

Kim

Lee

et al. 2018

Metals

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“…Furthermore, using the indentation technique, the hardness and Young's modulus of the samples can also be determined. 7,8 To date, the mechanical properties of Sn-based leadfree solders have been extensively investigated using the nanoindentation method at room temperature. Liu et al 8 studied the Sn-Bi, Sn-Ag-Cu, and Sn-Pb solder alloys by nanoindentation.…”

Section: Introductionmentioning

confidence: 99%

“…7,8 To date, the mechanical properties of Sn-based leadfree solders have been extensively investigated using the nanoindentation method at room temperature. Liu et al 8 studied the Sn-Bi, Sn-Ag-Cu, and Sn-Pb solder alloys by nanoindentation. It was reported that eutectic Sn-Ag-Cu solder is the stiffest, while eutectic Sn-Bi is the hardest among the solder alloys investigated.…”

Section: Introductionmentioning

confidence: 99%

Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Han

Jing

Nai

et al. 2009

Journal of Elec Materi

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The creep behavior and hardness of Sn-3.5Ag-0.7Cu solder were studied using Berkovich depth-sensing indentation at temperatures of 25°C to 125°C. Assuming a power-law relationship between the creep strain rate and stress, an activation energy of 40 kJ/mol and stress exponents of 7.4, 5.5, and 3.7 at 25°C, 75°C, and 125°C, respectively, were obtained. The results revealed that, with increasing temperature, the creep penetration and steady-state creep strain rate increased whereas the stress exponent decreased. The stress exponent and activation energy results also suggested that the creep mechanism is dislocation climb, assisted by diffusion through dislocation cores in Sn. Furthermore, the hardness results exhibited a decreasing trend with increasing temperature, which is attributed to softening at high temperature.

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“…Sn-Ag-Cu solder alloy has been employed as a major packaging material for a long time due to the better complex mechanical properties [1][2][3]. In recent study about SnxBi [4,5], Sn-10Bi solder alloy was found to be a kind of solder alloy with high hardness.…”

Section: Introductionmentioning

confidence: 99%

Effect of cooling method and aging treatment on the microstructure and mechanical properties of Sn–10Bi solder alloy

Lai

2015

J Mater Sci: Mater Electron

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The effects of cooling method and aging treatment on the microstructure and mechanical properties of Sn-10Bi solder alloy were investigated. The results showed that a kind of supersaturated b-Sn phase was found. More supersaturated b-Sn phase existed in Sn-10Bi solder alloy cooled in water and contributed to the higher ultimate tensile strength (about 83.8 MPa) compared with that cooled in air (about 63.6 MPa). After aged at 100°C for 10 h, the Bi fraction of aged supersaturated b-Sn phase was lower than the un-aged. The Bi fraction of the aged Snrich phase was higher than the un-aged. The mechanical properties of aged Sn-10Bi solder alloy cooled in air were almost unchanged compared with the original one. However, the mechanical properties of Sn-10Bi solder alloy cooled in water were damaged greatly compared with the original one. It was contributed by the coarsened grain and the Bi phase segregation in the grain boundary during aging.

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Nanoindentation of lead-free solders in microelectronic packaging

Cited by 43 publications

References 19 publications

Evaluation of Strain-Rate Sensitivity of Selective Laser Melted H13 Tool Steel Using Nanoindentation Tests

Evaluation of Strain-Rate Sensitivity of Selective Laser Melted H13 Tool Steel Using Nanoindentation Tests

Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Effect of cooling method and aging treatment on the microstructure and mechanical properties of Sn–10Bi solder alloy

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