Nanoink bridge-induced capillary pen printing for chemical sensors

Kahng, Seong-Joong; Chiew, Cerwyn; Dincau, Brian; Kim, Jong Hoon; Novosselov, Igor; Anantram, M. P.; Chung, Jae‐Hyun

doi:10.1088/1361-6528/aac84a

Cited by 12 publications

(9 citation statements)

References 29 publications

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“…The inset shows that, with an increase in the contact angle θ, a decrease in the width W and an increase in the thickness t of microdroplets on the surface are observed. In our experiments, as the substrate temperature increases from 100 to 300 • C, as in the work [41] due to the increase in the rate of evaporation of the nano-ink, the contact wetting angle θ is also likely to increase further, and as a result, there is a further increase in the aspect ratio of the lines from 0.17 to 0.70, respectively (see Figure 5b and Table 2). Table 2.…”

Section: Resultsmentioning

confidence: 50%

“…This increase in the aspect ratio of the line is probably due to an increase in the contact angle θ due to a change in the composition of the nano-ink due to their evaporation upon deposition on a heated substrate. An increase in the contact wetting angle θ with an increase in the substrate temperature was previously studied in [41] in the process of capillary printing of chemical sensors. In work [41] It was found that the contact wetting angle θ can vary over a wide range from 30 • to > 90 • depending on the temperature T s and the printing speed V s , and thus, to a large extent, determine the geometry of the formed lines from nano-ink.…”

Section: Resultsmentioning

confidence: 99%

“…An increase in the contact wetting angle θ with an increase in the substrate temperature was previously studied in [41] in the process of capillary printing of chemical sensors. In work [41] It was found that the contact wetting angle θ can vary over a wide range from 30 • to > 90 • depending on the temperature T s and the printing speed V s , and thus, to a large extent, determine the geometry of the formed lines from nano-ink. A schematic representation of the influence of the wetting angle θ on the geometry of the formed lines of nanomaterials with increasing temperature is shown in the inset in Figure 5b.…”

Section: Resultsmentioning

confidence: 99%

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Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

et al. 2020

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In this work, we studied the formation of conductive silver lines with high aspect ratios (AR = thickness/width) > 0.1 using the modernized method of aerosol jet printing on a heated silicon substrate. The geometric (AR) and electrical (resistivity) parameters of the formed lines were investigated depending on the number of printing layers (1–10 layers) and the temperature of the substrate (25–300 °C). The AR of the lines increased as the number of printing layers and the temperature of the substrate increased. An increase in the AR of the lines with increasing substrate temperature was associated with a decrease in the ink spreading as a result of an increase in the rate of evaporation of nano-ink. Moreover, with an increase in the substrate temperature of more than 200 °C, a significant increase in the porosity of the formed lines was observed, and as a result, the electrical resistivity of the lines increased significantly. Taking into account the revealed regularities, it was demonstrated that the formation of silver lines with a high AR > 0.1 and a low electrical resistivity of 2–3 μΩ∙cm is advisable to be carried out at a substrate temperature of about 100 °C. The adhesion strength of silver films formed on a heated silicon substrate is 2.8 ± 0.9 N/mm2, which further confirms the suitability of the investigated method of aerosol jet printing for electronic applications.

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Section: Resultsmentioning

confidence: 50%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

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Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

et al. 2020

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“…From the profilometry data, it can be seen that the line heights also increase, which, in particular, leads to an increase in the aspect ratio of the lines. This increase is due to the contact angle between microdroplets, which increases with substrate temperature [37,38]. Thus, it has been found that the optimum value of T s during printing should be in the order of 100 • C. At this substrate temperature, we carried out the experiments to establish the effect of the substrate speed V s and the number of printing layers N p on the width w and homogeneity of the obtained lines.…”

Section: Resultsmentioning

confidence: 99%

Optimizing Aerosol Jet Printing Process of Platinum Ink for High-Resolution Conductive Microstructures on Ceramic and Polymer Substrates

2021

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Printing nano-ink with platinum nanoparticles to generate conductive microstructures for electronics on different types of substrates has gained increasing interest in recent years. To solve the problem of the low conductivity of platinum (Pt) nano-ink, we synthesized chemically pure Pt nanoparticles with sizes of 18.2 ± 9.0 nm by spark discharge method. A low toxic solvent, ethylene glycol with water, was used to ensure the aggregation stability of Pt nanoparticles. Polyvinylpyrrolidone was used as an adhesive additive and binder in the nano-ink. Narrow and conductive Pt lines were generated by aerosol jet printing technology. The resistivity of the Pt lines sintered at 750 °C on alumina substrate was found to exceed the bulk Pt by about 13%. Moreover, the Pt film fabricated on polymer substrates has demonstrated excellent mechanical flexibility in terms of twisting tests.

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“…They are suitable for mass production, shortening the fabrication time and the design cycle [ 5 , 6 ]. Novel printing and coating methods have recently been reported for wearable devices, e.g., [ 7 , 8 , 9 , 10 ]. The deposition of conductive metals (e.g., Au, Ag, Cu) [ 2 ] and carbon-based inks such as carbon nanotubes [ 3 ] and graphene [ 4 ] on flexible substrates has been previously reported.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Inkjet-Printed Digital Microfluidics Devices

Chen

Choi

et al. 2021

Sensors

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Digital microfluidics (DMF) devices enable precise manipulation of small liquid volumes in point-of-care testing. A printed circuit board (PCB) substrate is commonly utilized to build DMF devices. However, inkjet printing can be used to fabricate DMF circuits, providing a less expensive alternative to PCB-based DMF designs while enabling more rapid design iteration cycles. We demonstrate the cleanroom-free fabrication process of a low-cost inkjet-printed DMF circuit. We compare Kapton and polymethyl methacrylate (PMMA) as dielectric coatings by measuring the minimal droplet actuation voltage for a range of actuation frequencies. A minimum actuation voltage of 5.6 V was required for droplet movement with the PMMA layer thickness of 0.2 μm and a hydrophobic layer of 0.17 μm. Significant issues with PMMA dielectric breakdown were observed at actuation voltages above 10 V. In comparison, devices that utilized Kapton were found to be more robust, even at an actuation voltage up to 100 V.

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Nanoink bridge-induced capillary pen printing for chemical sensors

Cited by 12 publications

References 29 publications

Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

Optimizing Aerosol Jet Printing Process of Platinum Ink for High-Resolution Conductive Microstructures on Ceramic and Polymer Substrates

Characterization of Inkjet-Printed Digital Microfluidics Devices

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