Nanolithography at 350 KV in a TEM

Broers, A. N.; Timbs, A.E.; Koch, R. H.

doi:10.1016/0167-9317(89)90044-0

Cited by 29 publications

(17 citation statements)

References 4 publications

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“…These microbridges are similar in nature to those observed through trans-mission electron microscope of thin lifted off patterns. 16 The increased sensitivity of the PMMA observed for the 2 m boxes was also observed in the fine lines. The exposure dose for the smallest, fully developed lines was 9.7 C/cm with ultrasonic agitation and 11.9 C/cm without ultrasonic agitation.…”

Section: B Fine Line Exposuresmentioning

confidence: 68%

A study of the effect of ultrasonic agitation during development of poly(methylmethacrylate) for ultrahigh resolution electron-beam lithography

Ryan¹

1995

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Articles you may be interested inOne step electron-beam lithography for multipurpose diffractive optical elements with 200 nm resolution An advanced epoxy novolac resist for fast high-resolution electron-beam lithography J. Vac. Sci. Technol. B 13, 3030 (1995); 10.1116/1.588316 Ultrahigh resolution chirped distributed feedback gratings fabricated by electron-beam lithography using bent waveguides for low-cost photonic components Experiments on poly͑methylmethacrylate͒ electron resist have been performed in order to understand how ultrasonic agitation during development affects sensitivity, contrast, and resolution. A modified JEOL 4000 EX electron microscope with a beam diameter of 1 nm was used for writing the resist patterns. First, the development/exposure characteristics of the ultrasonic development process were measured using large area ͑2ϫ2 m͒ patterns. With a 5 s develop in a mix of 3:7 cellosolve:methanol, it was found that ultrasonic agitation increases the effective sensitivity of the resist by roughly 20% but resist contrast does not change significantly ͑5.7Ϯ0.5͒. It was also found that the sensitivity increases approximately linearly with accelerating voltage from 75 to 400 kV but contrast does not change with voltage significantly. Resolution was explored by writing fine lines at progressively increasing doses in 60 nm of poly͑methylmethacrylate͒ and examining these lines with high resolution scanning electron microscopy. Complete development to the substrate was verified by wet etching a thin chromium layer underneath the resist. The narrowest lines that developed to the substrate had a width of about 10 nm although at this width considerable ''bridging'' of the lines was observed. We were unable with the ultrasonic agitation conditions used in our experiments to reduce the degree of bridging or the minimum linewidth.

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Section: B Fine Line Exposuresmentioning

confidence: 68%

A study of the effect of ultrasonic agitation during development of poly(methylmethacrylate) for ultrahigh resolution electron-beam lithography

Ryan¹

1995

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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“…Electron beam lithography has also been used for hole drilling [31], contamination-induced growth [32], surface modification of inorganic materials (SiO 2 , AlF 3 , etc.) as well as Langmuir-Blodgett or self-assembled films [33,34].…”

Section: Electron Beam Lithographymentioning

confidence: 99%

Nanofabrication: Conventional and nonconventional methods

2001

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Nanofabrication is playing an ever increasing role in science and technology on the nanometer scale and will soon allow us to build systems of the same complexity as found in nature. Conventional methods that emerged from microelectronics are now used for the fabrication of structures for integrated circuits, microelectro-mechanical systems, microoptics and microanalytical devices. Nonconventional or alternative approaches have changed the way we pattern very fine structures and have brought about a new appreciation of simple and low-cost techniques. We present an overview of some of these methods, paying particular attention to those which enable large-scale production of lithographic patterns. We preface the review with a brief primer on lithography and pattern transfer concepts. After reviewing the various patterning techniques, we discuss some recent application issues in the fields of microelectronics, optoelectronics, magnetism as well as in biology and biochemistry.

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“…45 The samples were developed in a methyl-isobutyl-ketone:isopropanol solution and then rinsed in isopropanol. Largescale contact pads and interconnects were created by optical lithography and liftoff of 1 nm of Ti and 50 nm of Au.…”

Section: Nanowire Samplesmentioning

confidence: 99%

Electrical testing of gold nanostructures by conducting atomic force microscopy

Bietsch

Schneider

Welland

et al. 2000

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Articles you may be interested inGrowth behavior of oxide nanostructures by electrical and thermal conductivities of substrate in atomic force microscope nano-oxidation Field emission induced fabrication of nanostructures on Au thin films using a noncontact mode atomic force microscope J.We devised a method for the reliable electrical testing of nanoscale wire arrays using conducting probe atomic force microscopy ͑AFM͒ in ambient conditions. A key requirement of this approach is the formation of highly reproducible electrical contacts between the conducting tip and the sample. We discuss the basic mechanical and electrical criteria of nanocontacts and derive a force-controlled protocol for the formation of low-ohmic contacts. Tips sputter coated with platinum provided the mechanical stability for both tapping-mode imaging and the formation of low-ohmic contacts on gold samples. Nanostructures on the sample were identified by topographic imaging and subsequently probed using the AFM tip as a mobile electrode. We measured resistivities in arrays of nanowires or local potentials of wires within electrical circuits, and detected electrical failures, thermal gradients, and small geometrical variations. The ability of this instrument to address electrical characteristics with high spatial resolution makes it a powerful tool for lithography developments and on-chip monitoring of nanoscale circuits.

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Nanolithography at 350 KV in a TEM

Cited by 29 publications

References 4 publications

A study of the effect of ultrasonic agitation during development of poly(methylmethacrylate) for ultrahigh resolution electron-beam lithography

A study of the effect of ultrasonic agitation during development of poly(methylmethacrylate) for ultrahigh resolution electron-beam lithography

Nanofabrication: Conventional and nonconventional methods

Electrical testing of gold nanostructures by conducting atomic force microscopy

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