“…Direct treatment of surfaces to alter their optical, morphological, wetting, and compositional properties, 44–46 generation and modification of nanoparticles, 47–51 selective thinning of 2D materials, 52 and doping of semiconductors 53 are only few applications of pulsed lasers in materials processing. The quality of surface structures produced, the chemical composition, and processing mechanisms depend on the laser type (wavelength, pulse duration, pulse energy, and repetition rate), characteristic of the target material (thermal properties and absorption coefficient), and ambient conditions (pressure, liquid/gas, and reactive/nonreactive) 51,54 . Laser ablation of the material starts from the absorption of laser photon energy followed by heating and photoionization of the irradiated area of the target surface.…”