Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperature

Marques, V.M.F.; Johnston, Colin; Grant, Patrick S.

doi:10.1016/j.actamat.2013.01.019

Cited by 83 publications

(36 citation statements)

References 34 publications

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“…Marques et al investigated IMC layers developed from solid-state diffusion in Sn-Ag-Cu/Cu joints. They showed that the Young's modulus of the Cu6Sn5 can vary by 14% when the indentations on the Cu6Sn5 are normal or parallel to the metallization plane [33]. Ghosh and Asta compared the Young's modulus of bulk and film type Cu6Sn5…”

Section: Discussionmentioning

confidence: 99%

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

Illés

Skwarek

Ratajczak

et al. 2019

Journal of Alloys and Compounds

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In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic grains and Sn whisker growth was investigated. In order to prevent the influence of the elements in the alloy composition and the effect of the soldering process on the formation of the intermetallic layer, 99.99% pure Sn was vacuum evaporated onto Cu substrates. The Sn layer thickness was sub-micron region (~400nm in average) to reach considerable and rapid compressive stress on the tin layer originated by the intermetallic formation. The samples were stored at room temperature for 1 month. Different types of whiskers (nodule and filament) and the layer structure underneath were studied with a scanning ion microscopy and transmission electron microscopy. It was found that not only the thickness of the intermetallic layer and shape of the intermetallic grains affects the whisker growth but the crystallographic structure of the intermetallic grains as well. The susceptibility of the Sn layer to whisker development is higher in those regions where the intermetallic layer is composed of monocrystalline grains instead of those regions, where it is composed of polycrystalline grains. This effect can be explained by the higher compressive stress generated by the monocrystalline intermetallics compared to the polycrystalline ones.

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Section: Discussionmentioning

confidence: 99%

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

Illés

Skwarek

Ratajczak

et al. 2019

Journal of Alloys and Compounds

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“…Among the numerous environmentally friendly leadfree solders, SnAgCu system solder alloy with its excellent mechanical properties and solder joint quality is of particular interest [1][2][3][4]. Given the complex service conditions of electronic products, research on the fracture and deformation behaviors [3][4][5][6], nanomechanical properties as a function of temperature [5][6][7][8][9][10] have been performed for lead-free solders recently. Further, the aim of the current study is to investigate the strain rate sensitivity of SnAgCu solder using nanoindentation.…”

Section: Introductionmentioning

confidence: 99%

Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

Xiao

Gao

Jia

et al. 2014

Materials Science and Engineering: A

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“…However, some researchers who conducted indentation tests using Cu/Sn IMCs reported that there were no cracks around the indentation. 6,9,10 Moreover, Deng et al 6 and Marquess et al 9 showed that pile-ups of Cu/Sn IMCs were observed around the indentation. These results suggest that both Cu 6 Sn 5 and Cu 3 Sn have plastic deformability.…”

Section: Evaluation For Tensile Characteristics Of Cu/sn Imcsmentioning

confidence: 96%

“…[5][6][7][8][9][10] Deng et al measured Young's moduli of Cu 3 Sn and Cu 6 Sn 5 in Cu/solder joints by nanoindentation. 5 They also extracted the yield stress of the IMCs from loading-unloading curves in nanoindentation processes.…”

Section: Introductionmentioning

confidence: 99%

An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

Ohguchi

Kurosawa

2016

Journal of Elec Materi

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In design of electronic packages, finite-element method (FEM) analysis for evaluating the strength and reliability of solder joints should be conducted with consideration of the presence of Cu/Sn intermetallic compounds (IMCs) generated at the interface between solder and copper wiring. To conduct such analysis accurately, the deformation characteristics of Cu/Sn IMCs must be clarified by conducting tensile tests. This paper describes a method to evaluate tensile characteristics of Cu/Sn IMCs. The method employs a composite specimen with first outer layer of Cu, second layer of Cu/Sn IMCs, and core of Sn-3.0Ag-0.5Cu lead-free solder. The specimen is made by a method in which a copper-plated solder specimen is heat treated at 453 K to generate Cu/Sn IMCs between the solder and copper. Tensile tests were conducted using the composite specimen. After the tests, the fracture appearance and characteristics of the stress-strain relations of the specimens were investigated. Based on the results, a numerical method based on the rule of mixtures (ROM) is proposed to estimate the stress-strain relation of Cu/Sn IMCs under tensile loading.

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Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperature

Cited by 83 publications

References 34 publications

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

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