Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects

Song, Jenn‐Ming; Huang, Bo; Liu, Cheng Yi; Lai, Yi-Sheng; Chiu, Ying Ta; Huang, Tzu Wen

doi:10.1016/j.msea.2011.11.037

Cited by 47 publications

(8 citation statements)

References 24 publications

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“…The relationship between the mechanical properties and crystal orientation of Cu 6 Sn 5 has been recently investigated using nanoindentation together with the EBSD technique. Song et al firstly conducted nanoindentation on Cu 6 Sn 5 in reflowed solder joints, and Cu 6 Sn 5 grown directionally by a liquidelectromigration technique [148]. It was found that the close packed ( 110) crystal plane of the directionally grown Cu 6 Sn 5 has the highest elastic modulus and hardness values.…”

Section: Elastic Modulus and Hardness Of Cu 6 Snmentioning

confidence: 99%

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

McDonald

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et al. 2016

Current Opinion in Solid State and Materials Science

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Section: Elastic Modulus and Hardness Of Cu 6 Snmentioning

confidence: 99%

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

McDonald

Read

et al. 2016

Current Opinion in Solid State and Materials Science

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“…Numerous studies have been devoted to the mechanical behavior of IMCs in solder joints. Effects of alloying, growth texture, allotropic transition, crystal structure and compositions of IMCS were well studied [7,[9][10][11][12][13]. However, the relationships between IMC mechanical properties and solder joint reliability have not been systematically investigated yet.…”

Section: Introductionmentioning

confidence: 99%

“…However, the relationships between IMC mechanical properties and solder joint reliability have not been systematically investigated yet. Our previous reports suggested that the plastic ability can be evaluated by ratio of elastic modulus/hardness (E/H) [9,11,12]. High E/H indicates better plastic ability for IMCs, while low E/H implies brittleness.…”

Section: Introductionmentioning

confidence: 99%

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

et al. 2020

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This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate material combinations. Nanoindentation was applied to investigate the mechanical properties of IMCs, including hardness, Young’s modulus, work hardening exponent, yield strength, and plastic ability. Experimental results suggest that nanoindentation responses of IMCs at joint interface definitely dominates joint impact performance. The greater the plastic ability the interfacial IMC exhibits, the superior impact energy the solder joints possess. The concept of mechanical and geometrical discontinuities was also proposed to explain brittle fracture of the solder joints with bi-layer interfacial IMCs subject to impact load.

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“…This technique is well suited to investigate the mechanical properties of IMCs, which have thicknesses of only several nanometers/micrometers. Cu-Al IMC was reported to form in SAC even with addition of as low as 0.05 wt.% [ 22 ]. Besides, it has been reported that Al is likely to substitute into Cu 6 Sn 5 as well [ 14 ] Previous studies with addition such as Ni, and Mn have shown that solubility of minor alloying element in Cu 6 Sn 5 could alter the nanomechanical properties of Cu 6 Sn 5 [ 14 ].…”

Section: Introductionmentioning

confidence: 99%

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Leong

Haseeb

2016

Materials

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Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

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Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects

Cited by 47 publications

References 24 publications

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

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