Nanoparticles Synthesis and Modification using Solution Plasma Process

Abstract

Across the most industry, the demand for nanoparticles is increasing. Therefore, many studies have been carried out to synthesize nanoparticles using various methods. The aim of this paper is to introduce an industryapplicable as well as financially and environmentally effective solution plasma process. The solution plasma process involves fewer chemicals than the traditional kit, and can be used to replace many of the chemical agents employed in previous synthesis of nanoparticles into plasma. In this study, this process is compared to the wet-reaction process that has thus far been widely used in the most industry. Furthermore, the solution plasma process has been classified into four different types (in-solution, out of solution, direct type, and remote type), according to its plasma occurrence position and plasma types. Thus, the source of radicals, nanoparticle synthesis, and modification methods are explained for each design. Lastly, unlike nanoparticles with hydrophilic functional groups that are made inside the solution, a nanoparticle synthesis and modification method to create a hydrophobic functional group is also proposed.

A Review of Plasma Synthesis Methods for Polymer Films and Nanoparticles under Atmospheric Pressure Conditions

“…APP generated on the outside of bulk liquid precursors—so-called (on-solution plasma)—is affected by natural air components. Therefore, chemical and physical reactions at the plasma–liquid interface take place with various species caused by the interaction between the APP and air components such as O 3 , N 2 O 5 , N 2 O, NHO 3 , H 2 , NO 3 , H 2 O 2 , HNO 2 , and NO 2 [ 38 ]. Complex reactions that are not well understood due to various radicals can produce unusual results [ 92 ].…”

“…In addition, the energetic electrons with high energy supplied from plasma can produce high concentrations of reactive species or free radicals from precursors [ 32 , 33 , 34 ]. This method not only has the degree of freedom for material selectivity without insolubility problems, but also reduces or eliminates the need for an oxidant or reductant [ 35 , 36 , 37 , 38 ]. Overall, plasma polymerization presents several advantages, such as simple installation, high reactivity, high throughput, fast processing, low cost, low temperature, and green synthesis [ 39 , 40 , 41 , 42 ].…”

“…We divide these APP polymer synthesis techniques into two types, depending on the phase of employed precursors: the first is APP polymerization, using a gas- or aerosol-type precursor [ 21 , 39 , 41 ], while the second is when the solution itself is supplied as a precursor [ 38 , 43 , 44 ], as shown Figure 1 . In this review, the former is referred to as the gas/aerosol-through-plasma (GATP) method, and the latter is denominated as the solution plasma method.…”

Facile Preparation of Ni-Co Bimetallic Oxide/Activated Carbon Composites Using the Plasma in Liquid Process for Supercapacitor Electrode Applications

“…Nickel and cobalt precipitated uniformly on AC. Ni 2+ and Co 2+ were produced in the aqueous reactant solution by the dissociation of nickel and cobalt precursors were reduced to Ni 0 and Co 0 due to chemical activated species in the plasma field, particularly hydrogen radicals, and precipitated on the AC surface [28,29]. On the other hand, the mapping result shown in the upper right corner of Figure 2 shows the presence of many oxygen elements on the AC surface.…”

In-Liquid Plasma Process for Size- and Shape-Controlled Synthesis of Silver Nanoparticles by Controlling Gas Bubbles in Water

“…Solution (or liquid) plasma process (SPP, or LPP) and atmospheric pressure plasma (APP) are new useful and simple preparation methods of metal nanoparticles (NPs) because this nonequilibrium plasma can provide rapid reactions due to the reactive chemical species, i.e., radicals [ 1 , 2 , 3 , 4 , 5 ]. APP with low energy is affected by oxygen, nitrogen, and humidity in the atmosphere, as well as by its solvent and process gas [ 6 ]. However, SPP is only affected by solvent and process gas.…”