“…It is well documented that, for a given ferroelectric material, the electrical and reliability properties are strongly influenced by the integrated process, especially for the etching process [3,4]. Hence, to establish an integrated process being compatible with CMOS technique and without etching damage is important for ferroelectric capacitors applications, an innovated process has been attempted and ferroelectric properties of the capacitor were described formerly [2,[5][6][7], but other reliability properties are not investigated, such as leakage current, dielectric and time dependent dielectric breakdown etc. The leakage current is a sensitive diagnostic tool for monitoring material parameters, such as fatigue, retention, aging, power consumption, reliability and time dependent dielectric breakdown [8].…”