2009
DOI: 10.1143/jjap.48.011401
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Nanoscale and Spatial Variations Investigation of Etch Damage in Integrated Ferroelectric Capacitor Side Wall by Piezoresponse Force Microscopy

Abstract: The nanoscale and spatial variations etch damage in the typical integrated process ferroelectric capacitors (TIP-FeCAPs) and the innovated integrated process ferroelectric capacitors (IIP-FeCAPs) side wall is investigated by three-dimensional piezoresponse force microscopy (PFM). The topography of the IIP-FeCAP displays explicit and smooth profile with uniform compact columnar grains microstructure in the side wall, while the TIP-FeCAP side wall displays a coarse profile with irregular shape and two non-unifor… Show more

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“…It is well documented that, for a given ferroelectric material, the electrical and reliability properties are strongly influenced by the integrated process, especially for the etching process [3,4]. Hence, to establish an integrated process being compatible with CMOS technique and without etching damage is important for ferroelectric capacitors applications, an innovated process has been attempted and ferroelectric properties of the capacitor were described formerly [2,[5][6][7], but other reliability properties are not investigated, such as leakage current, dielectric and time dependent dielectric breakdown etc. The leakage current is a sensitive diagnostic tool for monitoring material parameters, such as fatigue, retention, aging, power consumption, reliability and time dependent dielectric breakdown [8].…”
Section: Introductionmentioning
confidence: 99%
“…It is well documented that, for a given ferroelectric material, the electrical and reliability properties are strongly influenced by the integrated process, especially for the etching process [3,4]. Hence, to establish an integrated process being compatible with CMOS technique and without etching damage is important for ferroelectric capacitors applications, an innovated process has been attempted and ferroelectric properties of the capacitor were described formerly [2,[5][6][7], but other reliability properties are not investigated, such as leakage current, dielectric and time dependent dielectric breakdown etc. The leakage current is a sensitive diagnostic tool for monitoring material parameters, such as fatigue, retention, aging, power consumption, reliability and time dependent dielectric breakdown [8].…”
Section: Introductionmentioning
confidence: 99%