Nanostructural evolution in films of alloy Zn90Al7Cu3

Zhu, Yao; Lee, Wing Bun; To, Suet

doi:10.1016/j.matchar.2004.05.005

Cited by 4 publications

(2 citation statements)

References 32 publications

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“…Compared with Li addition, increasing Na content caused a reduction in the growth of the Cu 5 Zn 8 layer, during aging at 250°C. 12 Zhu et al 29 found that, for 90Zn-7Al-3Cu (wt.%) alloy prepared as thin films, the nanophase (Zn) decomposed during aging at 220°C for 105 h. As products of the eutectoid decomposition of the nanophase (Zn), the amount of the two phases [eutectic Zn-5.3Al and nanophase s¢ 10Zn-35Al-55Cu (wt.%)] increased during further aging. 29 In this study, XRD analysis could not identify the s¢-phase.…”

Section: Aging Treatmentmentioning

confidence: 99%

“…12 Zhu et al 29 found that, for 90Zn-7Al-3Cu (wt.%) alloy prepared as thin films, the nanophase (Zn) decomposed during aging at 220°C for 105 h. As products of the eutectoid decomposition of the nanophase (Zn), the amount of the two phases [eutectic Zn-5.3Al and nanophase s¢ 10Zn-35Al-55Cu (wt.%)] increased during further aging. 29 In this study, XRD analysis could not identify the s¢-phase. This could be because the phase is small, as the EDS analysis at point 57 revealed the possibility of the presence of fine precipitates of this s¢-phase.…”

Section: Aging Treatmentmentioning

confidence: 99%

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Influence of Li Addition to Zn-Al Alloys on Cu Substrate During Spreading Test and After Aging Treatment

Gancarz

Pstruś

Cempura

et al. 2016

Journal of Elec Materi

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The spreading of Zn-Al eutectic-based alloys with 0.05 wt.%, 0.1 wt.%, and 0.2 wt.% Li on Cu substrate has been studied using the sessile drop method in presence of QJ201 flux. Wetting tests were performed after 1 min, 3 min, 8 min, 15 min, 30 min, and 60 min of contact at temperatures of 475°C, 500°C, 525°C, and 550°C. Samples after spreading at 500°C for 1 min were subjected to aging for 1 day, 10 days, and 30 days at temperature of 120°C, 170°C, and 250°C. The spreadability of eutectic Zn-5.3Al alloy with different Li contents on Cu substrate was determined in accordance with ISO 9455-10:2013-03. Selected solidified solder-substrate couples were, after spreading and aging tests, cross-sectioned and subjected to scanning electron microscopy, energydispersive spectroscopy (EDS), and x-ray diffraction (XRD) analysis of the interfacial microstructure. An experiment was designed to demonstrate the effect of Li addition on the kinetics of the formation and growth of CuZn, Cu 5 Zn 8 , and CuZn 4 intermetallic compound (IMC) phases, during spreading and aging. The IMC layers formed at the interface were identified using XRD and EDS analyses. Increasing addition of Li to Zn-Al alloy caused a reduction in the thickness of the IMC layer at the interface during spreading, and an increase during aging. The activation energy was calculated, being found to increase for the Cu 5 Zn 8 phase but decrease for the CuZn and CuZn 4 phases with increasing Li content in the Zn-Al-Li alloys. The highest value of 142 kJ mol À1 was obtained for Zn-Al with 1.0 Li during spreading and 69.2 kJ mol À1 for Zn-Al with 0.05 Li during aging. Aging at 250°C caused an increase in only the Cu 5 Zn 8 layer, which has the lowest Gibbs energy in the Cu-Zn system. This result is connected to the high diffusion of Cu from the substrate to the solder.

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Section: Aging Treatmentmentioning

confidence: 99%